742008: SEMICONDUCTOR DEVICE,THYRISTOR.
The SEMICONDUCTOR DEVICE,THYRISTOR is a the manufacturer industrial component. Key specifications include material: GLASS ENCLOSURE, overall_width: 1.34 INCHES NOMINAL IN, overall_height: 1.18 INCHES NOMINAL IN, overall_length: 3.7 INCHES NOMINAL IN, mounting_method: UNTHREADED HOLE(S), features_provided: W/HEAT SINK. This part is cataloged in the U.S.
Government catalog under NSN 5961-01-606-5507, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | GLASS ENCLOSURE |
| overall_width | 1.34 INCHES NOMINAL IN |
| overall_height | 1.18 INCHES NOMINAL IN |
| overall_length | 3.7 INCHES NOMINAL IN |
| mounting_method | UNTHREADED HOLE(S) |
| features_provided | W/HEAT SINK |
| semiconductor_material | SILICON |
| end_item_identification | POWER SUPPLY |
| mounting_facility_quantity | 2 |
| terminal_type_and_quantity | 3 THREADED HOLE |
| function_for_which_designed | RECTIFIER |
| power_rating_per_characteristic | 12.0 WATTS NOMINAL PEAK GATE POWER DISSIPATION |
| NSN | 5961-01-606-5507 |
| OVERALL HEIGHT | 1.18 INCHES NOMINAL IN |
| VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 1800.0 MAXIMUM REPETITIVE PEAK REVERSE VOLTAGE |
| MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 125.0 CELSIUS AMBIENT AIR DEGC |
| MOUNTING FACILITY QUANTITY | 2 |
| MOUNTING METHOD | UNTHREADED HOLE(S) |
| SEMICONDUCTOR MATERIAL | SILICON |
| OVERALL LENGTH | 3.7 INCHES NOMINAL IN |
| OVERALL WIDTH | 1.34 INCHES NOMINAL IN |
| FEATURES PROVIDED | W/HEAT SINK |
| CURRENT RATING PER CHARACTERISTIC | 150.0 AMPERES MAXIMUM AVERAGE FORWARD CURRENT AVERAGED OVER A FULL 60-HZ CYCLE |
No substitute or cross-reference records for this part.