726009-6: MICROCIRCUIT,DIGITAL.
The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include bit_quantity: 2048, word_quantity: 512, features_provided: W/ENABLE AND HERMETICALLY SEALED AND 3-STATE OUTPUT AND MONOLITHIC, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC, memory_device_type: ROM. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-138-6198, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| bit_quantity | 2048 |
| word_quantity | 512 |
| features_provided | W/ENABLE AND HERMETICALLY SEALED AND 3-STATE OUTPUT AND MONOLITHIC |
| output_logic_form | TRANSISTOR-TRANSISTOR LOGIC |
| inclosure_material | CERAMIC |
| memory_device_type | ROM |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| test_data_document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| operating_temp_range | +0.0 TO 75.0 CELSIUS DEGC |
| input_circuit_pattern | 10 INPUT |
| inclosure_configuration | DUAL-IN-LINE |
| terminal_surface_treatment | SOLDER |
| NSN | 5962-01-138-6198 |
| BIT QUANTITY | 2048 |
| INPUT CIRCUIT PATTERN | 10 INPUT |
| WORD QUANTITY | 512 |
| INCLOSURE MATERIAL | CERAMIC |
| TERMINAL SURFACE TREATMENT | SOLDER |
| FEATURES PROVIDED | W/ENABLE AND HERMETICALLY SEALED AND 3-STATE OUTPUT AND MONOLITHIC |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| MEMORY DEVICE TYPE | ROM |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |
| OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |