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Technical Data Sheet
725004-277 ✓ Verified by PartsTable
· COMPONENT
WHAT YOU NEED TO KNOW
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PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.350 INCHES MINIMUM AND 0.390 INCHES MAXIMUM IN, body_height: 0.150 INCHES MINIMUM AND 0.210 INCHES MAXIMUM IN, body_length: 1.260 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND W/ENABLE, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC AND GLASS. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-123-7996, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
725004-277
NSN: 5962-01-123-7996
FSC: 5962
CAGE: 05869 — RAYTHEON COMPANY DIV RMD STRATEGIC (USA)
SPECIFICATIONS
body_width0.350 INCHES MINIMUM AND 0.390 INCHES MAXIMUM IN
body_height0.150 INCHES MINIMUM AND 0.210 INCHES MAXIMUM IN
body_length1.260 INCHES MAXIMUM IN
features_providedHERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND W/ENABLE
output_logic_formCOMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_materialCERAMIC AND GLASS
memory_device_typeRAM
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern15 INPUT
inclosure_configurationDUAL-IN-LINE
terminal_surface_treatmentSOLDER
NSN5962-01-123-7996
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 725004-277 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
INCLOSURE CONFIGURATION: DUAL-IN-LINE
INPUT CIRCUIT PATTERN: 15 INPUT
MAXIMUM POWER DISSIPATION RATING: 1.0 WATTS
TIME RATING PER CHACTERISTIC: 800.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 800.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS
BODY WIDTH: 0.350 INCHES MINIMUM AND 0.390 INCHES MAXIMUM IN
STORAGE TEMP RANGE: -65.0 TO 150.0 CELSIUS DEGC
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: -0.5 VOLTS MINIMUM POWER SOURCE AND 7.5 VOLTS MAXIMUM POWER SOURCE
FEATURES PROVIDED: HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND W/ENABLE
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS (FLIS)
INCLOSURE CONFIGURATIONDUAL-IN-LINE
INPUT CIRCUIT PATTERN15 INPUT
MAXIMUM POWER DISSIPATION RATING1.0 WATTS
TIME RATING PER CHACTERISTIC800.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 800.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS
BODY WIDTH0.350 INCHES MINIMUM AND 0.390 INCHES MAXIMUM IN
STORAGE TEMP RANGE-65.0 TO 150.0 CELSIUS DEGC
VOLTAGE RATING AND TYPE PER CHARACTERISTIC-0.5 VOLTS MINIMUM POWER SOURCE AND 7.5 VOLTS MAXIMUM POWER SOURCE
FEATURES PROVIDEDHERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND W/ENABLE
OPERATING TEMP RANGE-55.0 TO 125.0 CELSIUS DEGC
BODY LENGTH1.260 INCHES MAXIMUM IN
VERIFIED SUBSTITUTES & CROSS-REFERENCES 18
5962-01-GL2-5723Interchangeable
interchangeable cross-reference
interchangeable
93577Interchangeable
interchangeable cross-reference
interchangeable
MW505101ADL3Interchangeable
interchangeable cross-reference
interchangeable
10154443Interchangeable
interchangeable cross-reference
interchangeable
CDP1822CD/3Interchangeable
interchangeable cross-reference
interchangeable
B4010134Interchangeable
interchangeable cross-reference
interchangeable
LIFECYCLE
StatusACTIVE
AvailabilityOEM and secondary market
RoHS CompliantEAR99ESD SensitiveNot HAZMAT
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FREQUENTLY ASKED QUESTIONS
What is 725004-277?
725004-277 is a MICROCIRCUIT,MEMORY.
What parts can replace 725004-277?
There are 18 known substitutes for 725004-277: 5962-01-GL2-5723, 93577, MW505101ADL3 and 15 more. Substitute compatibility should be verified for your specific system.
What is the NSN for 725004-277?
725004-277 is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-123-7996. This indicates validated use in U.S. government and defense supply chains.
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