SOCKET,PLUG-IN ELECTRONIC COMPON. Key specifications include material: COPPER ALLOY CONTACT, mounting_method: BODY THROUGH HOLE, features_provided: COMPONENT RETAINING DEVICE, precious_material: GOLD, surface_treatment: GOLD CONTACT, fabrication_method: MOLDED. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5935-00-555-1888, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | COPPER ALLOY CONTACT |
| mounting_method | BODY THROUGH HOLE |
| features_provided | COMPONENT RETAINING DEVICE |
| precious_material | GOLD |
| surface_treatment | GOLD CONTACT |
| fabrication_method | MOLDED |
| mounting_hole_style | ROUND, W/TWO MOUNTING HOLES |
| mounting_hole_diameter | 0.138 INCHES NOMINAL IN |
| terminal_type_and_quantity | 20 TAB, SOLDER LUG |
| precious_material_and_weight | 0.020 GOLD GRAINS, TROY |
| accommodated_contact_quantity | 20 |
| precious_material_and_location | CONTACT SURFACES GOLD |
| NSN | 5935-00-555-1888 |
| MOUNTING METHOD | BODY THROUGH HOLE |
| MATERIAL | COPPER ALLOY CONTACT |
| PRECIOUS MATERIAL AND LOCATION | CONTACT SURFACES GOLD |
| MATERIAL | PLASTIC BODY |
| TERMINAL TYPE AND QUANTITY | 20 TAB, SOLDER LUG |
| PRECIOUS MATERIAL AND WEIGHT | 0.020 GOLD GRAINS, TROY |
| PRECIOUS MATERIAL | GOLD |
| SURFACE TREATMENT | GOLD CONTACT |
| FEATURES PROVIDED | COMPONENT RETAINING DEVICE |
| MOUNTING TYPE FOR WHICH DESIGNED | CHASSIS |