7225950 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

7225950: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include bearings: NOT INCLUDED, material: COPPER ALLOY OVERALL, bore_type: STRAIGHT, face_width: 17.00 MILLIMETERS NOMINAL MM, bore_length: 8.75 MILLIMETERS NOMINAL MM, design_form: SPOKED. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-371-5624, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

7225950

NSN: 5962-01-371-5624
NIINs: 013715624, 014837634
FSC: 5962 — Microcircuits, Electronic
CAGE: 05869 — RAYTHEON COMPANY DIV RMD STRATEGIC (USA)

SPECIFICATIONS

bearings	NOT INCLUDED
material	COPPER ALLOY OVERALL
bore_type	STRAIGHT
face_width	17.00 MILLIMETERS NOMINAL MM
bore_length	8.75 MILLIMETERS NOMINAL MM
design_form	SPOKED
bore_feature	INCLUDED
groove_depth	14.00 MILLIMETERS NOMINAL MM
groove_shape	U
groove_width	14.00 MILLIMETERS NOMINAL MM
bore_diameter	20.00 MILLIMETERS NOMINAL MM
groove_radius	5.4 MILLIMETERS NOMINAL MM
NSN	5962-01-371-5624

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 17 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

FEATURES PROVIDED: BURN IN AND ELECTROSTATIC SENSITIVE AND MONOLITHIC AND PROGRAMMED

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: EPROM

•

STORAGE TEMP RANGE: -65.0 TO 125.0 CELSIUS DEGC

•

OUTPUT LOGIC FORM: N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	17 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
FEATURES PROVIDED	BURN IN AND ELECTROSTATIC SENSITIVE AND MONOLITHIC AND PROGRAMMED
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	EPROM
STORAGE TEMP RANGE	-65.0 TO 125.0 CELSIUS DEGC
OUTPUT LOGIC FORM	N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
VOLTAGE RATING AND TYPE PER CHARACTERISTIC	7.0 VOLTS MAXIMUM POWER SOURCE
OPERATING TEMP RANGE	+0.0 TO 70.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES 1

ROM/PROM FAMILY 091Reference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is 7225950?

7225950 is a MICROCIRCUIT,MEMORY.

What parts can replace 7225950?

There is 1 known substitute for 7225950: ROM/PROM FAMILY 091. Substitute compatibility should be verified for your specific system.

What is the NSN for 7225950?

7225950 is cataloged in the U.S. Government catalog under NSN 5962-01-371-5624. This indicates validated use in U.S. government and defense supply chains.

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7225950 — MICROCIRCUIT,MEMORY

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