72-01320-107 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

72-01320-107: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.515 INCHES MINIMUM AND 0.599 INCHES MAXIMUM IN, body_height: 0.096 INCHES MINIMUM AND 0.142 INCHES MAXIMUM IN, body_length: 1.425 INCHES MAXIMUM IN, memory_capacity: UNKNOWN, features_provided: HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND ERASABLE AND W/ENABLE, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-277-3337, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

72-01320-107

NSN: 5962-01-277-3337
FSC: 5962 — Microcircuits, Electronic
CAGE: 00724 — RAYTHEON COMPANY (USA)

SPECIFICATIONS

body_width	0.515 INCHES MINIMUM AND 0.599 INCHES MAXIMUM IN
body_height	0.096 INCHES MINIMUM AND 0.142 INCHES MAXIMUM IN
body_length	1.425 INCHES MAXIMUM IN
memory_capacity	UNKNOWN
features_provided	HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND ERASABLE AND W/ENABLE
output_logic_form	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	24 INPUT
NSN	5962-01-277-3337

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 24 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.515 INCHES MINIMUM AND 0.599 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.096 INCHES MINIMUM AND 0.142 INCHES MAXIMUM IN

•

FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND ERASABLE AND W/ENABLE

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: ROM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	24 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.515 INCHES MINIMUM AND 0.599 INCHES MAXIMUM IN
BODY HEIGHT	0.096 INCHES MINIMUM AND 0.142 INCHES MAXIMUM IN
FEATURES PROVIDED	HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND ERASABLE AND W/ENABLE
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	ROM
BODY LENGTH	1.425 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES 1

ROM/PROMReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Demilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is 72-01320-107?

72-01320-107 is a MICROCIRCUIT,MEMORY.

What parts can replace 72-01320-107?

There is 1 known substitute for 72-01320-107: ROM/PROM. Substitute compatibility should be verified for your specific system.

What is the NSN for 72-01320-107?

72-01320-107 is cataloged in the U.S. Government catalog under NSN 5962-01-277-3337. This indicates validated use in U.S. government and defense supply chains.

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72-01320-107 — MICROCIRCUIT,MEMORY

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