719499-035: SOCKET,PLUG-IN ELECTRONIC COMPON.
SOCKET,PLUG-IN ELECTRONIC COMPON. Key specifications include material: COPPER ALLOY CONTACT, mounting_method: PRESS FIT, precious_material: GOLD, surface_treatment: GOLD CONTACT, fabrication_method: MOLDED, mounting_hole_style: ROUND, BODY. This part is cataloged in the U.S.
Government catalog under NSN 5935-00-761-3671, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | COPPER ALLOY CONTACT |
| mounting_method | PRESS FIT |
| precious_material | GOLD |
| surface_treatment | GOLD CONTACT |
| fabrication_method | MOLDED |
| mounting_hole_style | ROUND, BODY |
| terminal_type_and_quantity | 4 SOLDER STUD |
| precious_material_and_weight | 0.020 GOLD GRAINS, TROY |
| accommodated_contact_quantity | 4 |
| precious_material_and_location | CONTACT SURFACES GOLD |
| specific_equipment_accommodated | SEMICONDUCTOR DEVICE |
| mounting_type_for_which_designed | CHASSIS |
| NSN | 5935-00-761-3671 |
| MOUNTING HOLE STYLE | ROUND, BODY |
| ACCOMMODATED CONTACT QUANTITY | 4 |
| PRECIOUS MATERIAL | GOLD |
| MOUNTING METHOD | PRESS FIT |
| BODY MOUNTING HOLE ACCOMMODATION DIAMETER | 0.289 INCHES NOMINAL IN |
| SPECIFIC EQUIPMENT ACCOMMODATED | SEMICONDUCTOR DEVICE |
| PRECIOUS MATERIAL AND WEIGHT | 0.020 GOLD GRAINS, TROY |
| SURFACE TREATMENT | GOLD CONTACT |
| MOUNTING TYPE FOR WHICH DESIGNED | CHASSIS |
| PRECIOUS MATERIAL AND LOCATION | CONTACT SURFACES GOLD |