717803147-001 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

717803147-001: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN, body_height: 0.060 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN, body_length: 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN, overall_width: 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN, overall_height: 0.060 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN, overall_length: 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-356-0178, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

717803147-001

NSN: 5962-01-356-0178
FSC: 5962 — Microcircuits, Electronic
CAGE: 04939 — LOCKHEED MARTIN CORPORATION (USA)

SPECIFICATIONS

body_width	0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN
body_height	0.060 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN
body_length	0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN
overall_width	0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN
overall_height	0.060 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN
overall_length	0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN
features_provided	BIDIRECTIONAL AND ELECTROSTATIC SENSITIVE AND MONOLITHIC AND PROGRAMMABLE
output_logic_form	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	PAL
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
NSN	5962-01-356-0178

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 18 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.060 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

OVERALL HEIGHT	0.060 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN
INPUT CIRCUIT PATTERN	18 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN
BODY HEIGHT	0.060 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN
OVERALL LENGTH	0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN
OVERALL WIDTH	0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN
FEATURES PROVIDED	BIDIRECTIONAL AND ELECTROSTATIC SENSITIVE AND MONOLITHIC AND PROGRAMMABLE
INCLOSURE CONFIGURATION	LEADLESS FLAT PACK

SUBSTITUTES & CROSS-REFERENCES 2

5962-89839022AReference document

Same NSN cross-reference

Reference document — Secondary reference

ROM/PROMReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure

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FREQUENTLY ASKED QUESTIONS

What is 717803147-001?

717803147-001 is a MICROCIRCUIT,MEMORY.

What parts can replace 717803147-001?

There are 2 known substitutes for 717803147-001: 5962-89839022A, ROM/PROM. Substitute compatibility should be verified for your specific system.

What is the NSN for 717803147-001?

717803147-001 is cataloged in the U.S. Government catalog under NSN 5962-01-356-0178. This indicates validated use in U.S. government and defense supply chains.

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717803147-001 — MICROCIRCUIT,MEMORY

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