The SEMICONDUCTOR DEVICES,UNITIZED is a the manufacturer industrial component. Key specifications include material: GLASS ENCLOSURE, overall_width: 0.358 INCHES MAXIMUM IN, overall_height: 0.100 INCHES MAXIMUM IN, overall_length: 0.358 INCHES MAXIMUM IN, mounting_method: PRESS FIT, special_features: ALL SEMICONDUCTOR DEVICE DIODE JUNCTION PATTERN ARRANGEMENT: PN. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5961-01-291-2887, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | GLASS ENCLOSURE |
| overall_width | 0.358 INCHES MAXIMUM IN |
| overall_height | 0.100 INCHES MAXIMUM IN |
| overall_length | 0.358 INCHES MAXIMUM IN |
| mounting_method | PRESS FIT |
| special_features | ALL SEMICONDUCTOR DEVICE DIODE JUNCTION PATTERN ARRANGEMENT: PN |
| features_provided | ELECTROSTATIC SENSITIVE |
| semiconductor_material | SILICON ALL SEMICONDUCTOR DEVICE DIODE |
| terminal_type_and_quantity | 20 UNINSULATED WIRE LEAD |
| component_name_and_quantity | 4 SEMICONDUCTOR DEVICE DIODE |
| voltage_tolerance_in_percent | -5.0 TO 5.0 ALL SEMICONDUCTOR DEVICE DIODE |
| power_rating_per_characteristic | 400.0 MILLIWATTS MAXIMUM TOTAL DEVICE DISSIPATION ALL SEMICONDUCTOR DEVICE DIODE |
| NSN | 5961-01-291-2887 |
| SPECIAL FEATURES | ALL SEMICONDUCTOR DEVICE DIODE JUNCTION PATTERN ARRANGEMENT: PN |
| SEMICONDUCTOR MATERIAL | SILICON ALL SEMICONDUCTOR DEVICE DIODE |
| OVERALL WIDTH | 0.358 INCHES MAXIMUM IN |
| OVERALL HEIGHT | 0.100 INCHES MAXIMUM IN |
| MATERIAL | GLASS ENCLOSURE |
| VOLTAGE TOLERANCE IN PERCENT | -5.0 TO 5.0 ALL SEMICONDUCTOR DEVICE DIODE |
| TERMINAL TYPE AND QUANTITY | 20 UNINSULATED WIRE LEAD |
| VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 9.55 MAXIMUM NOMINAL REGULATOR VOLTAGE ALL SEMICONDUCTOR DEVICE DIODE |
| MOUNTING METHOD | PRESS FIT |
| COMPONENT NAME AND QUANTITY | 4 SEMICONDUCTOR DEVICE DIODE |