717744154-009 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

717744154-009: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include features_provided: PROGRAMMED AND SCHOTTKY AND HIGH IMPEDANCE, output_logic_form: BIPOLAR METAL-OXIDE SEMICONDUCTOR, inclosure_material: CERAMIC, memory_device_type: PROM, storage_temp_range: -65.0 TO 150.0 CELSIUS DEGC, operating_temp_range: -55.0 TO 125.0 CELSIUS DEGC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-372-5028, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

717744154-009

NSN: 5962-01-372-5028
FSC: 5962 — Microcircuits, Electronic
CAGE: 04939 — LOCKHEED MARTIN CORPORATION (USA)

SPECIFICATIONS

features_provided	PROGRAMMED AND SCHOTTKY AND HIGH IMPEDANCE
output_logic_form	BIPOLAR METAL-OXIDE SEMICONDUCTOR
inclosure_material	CERAMIC
memory_device_type	PROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
hybrid_technology_type	MONOLITHIC
end_item_identification	DEPOT SE RF T E/I FSCM 04939
inclosure_configuration	DUAL-IN-LINE
terminal_surface_treatment	SOLDER
specification/standard_data	81349--38510/21002BJA GOVERNMENT SPECIFICATION
time_rating_per_chacteristic	100.00 NANOSECONDS NOMINAL ACCESS AND 50.00 NANOSECONDS NOMINAL ACCESS NS
NSN	5962-01-372-5028

COMPONENT DIAGRAM

KEY FEATURES

•

HYBRID TECHNOLOGY TYPE: MONOLITHIC

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

FEATURES PROVIDED: PROGRAMMED AND SCHOTTKY AND HIGH IMPEDANCE

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

PURCHASE DESCRIPTION IDENTIFICATION: 04939-717744154-009

•

CURRENT RATING PER CHARACTERISTIC: 100.00 MILLIAMPERES MAXIMUM OUTPUT SINK

•

MEMORY DEVICE TYPE: PROM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

HYBRID TECHNOLOGY TYPE	MONOLITHIC
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
FEATURES PROVIDED	PROGRAMMED AND SCHOTTKY AND HIGH IMPEDANCE
INCLOSURE CONFIGURATION	DUAL-IN-LINE
PURCHASE DESCRIPTION IDENTIFICATION	04939-717744154-009
CURRENT RATING PER CHARACTERISTIC	100.00 MILLIAMPERES MAXIMUM OUTPUT SINK
MEMORY DEVICE TYPE	PROM
DEPARTURE FROM CITED DESIGNATOR	ALTERED BY PROGRAMMING,TESTING & MARKING
CASE OUTLINE SOURCE AND DESIGNATOR	D-3 MIL-M-38510

OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic

Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.

5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909

SUBSTITUTES & CROSS-REFERENCES 2

ROM/PROMReference document

Same NSN cross-reference

Reference document — Secondary reference

M38510/21002BJAReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is 717744154-009?

717744154-009 is a MICROCIRCUIT,MEMORY.

What parts can replace 717744154-009?

There are 2 known substitutes for 717744154-009: ROM/PROM, M38510/21002BJA. Substitute compatibility should be verified for your specific system.

What is the NSN for 717744154-009?

717744154-009 is cataloged in the U.S. Government catalog under NSN 5962-01-372-5028. This indicates validated use in U.S. government and defense supply chains.

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