717719777-009: MICROCIRCUIT SET.
The MICROCIRCUIT SET is a the manufacturer industrial component. Key specifications include memory_device_type: PAL, operating_temp_range: -55.0 TO 125.0 CELSIUS DEGC, end_item_identification: HU ;LANTIRN, inclosure_configuration: LEADLESS FLAT PACK, terminal_type_and_quantity: 28 LEADLESS, design_function_and_quantity: 1 MEMORY, PROGRAMMED ARRAY LOGIC. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-392-9156, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| memory_device_type | PAL |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| end_item_identification | HU ;LANTIRN |
| inclosure_configuration | LEADLESS FLAT PACK |
| terminal_type_and_quantity | 28 LEADLESS |
| design_function_and_quantity | 1 MEMORY, PROGRAMMED ARRAY LOGIC |
| time_rating_per_chacteristic | 10.00 NANOSECONDS MAXIMUM PROPAGATION DELAY NS |
| component_function_relationship | MATCHED |
| microcircuit_device_type_and_quantity | 2 MEMORY |
| voltage_rating_and_type_per_characteristic | -0.5 VOLTS MINIMUM APPLIED AND 7.0 VOLTS MAXIMUM APPLIED |
| NSN | 5962-01-392-9156 |
| COMPONENT FUNCTION RELATIONSHIP | MATCHED |
| DESIGN FUNCTION AND QUANTITY | 1 MEMORY, PROGRAMMED ARRAY LOGIC |
| MICROCIRCUIT DEVICE TYPE AND QUANTITY | 2 MEMORY |
| INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| MEMORY DEVICE TYPE | PAL |
| VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM APPLIED AND 7.0 VOLTS MAXIMUM APPLIED |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS DEGC |
| END ITEM IDENTIFICATION | HU ;LANTIRN |
| TERMINAL TYPE AND QUANTITY | 28 LEADLESS |
| TIME RATING PER CHACTERISTIC | 10.00 NANOSECONDS MAXIMUM PROPAGATION DELAY NS |