717382-9 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

717382-9: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.560 INCHES MAXIMUM IN, body_height: 0.180 INCHES MAXIMUM IN, body_length: 1.290 INCHES MAXIMUM IN, overall_height: 0.300 INCHES NOMINAL IN, memory_capacity: UNKNOWN, features_provided: HERMETICALLY SEALED AND PROGRAMMABLE AND W/RESISTOR AND POSITIVE OUTPUTS. This part is cataloged in the U.S.

Government catalog under NSN 5962-00-243-0788, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

717382-9

NSN: 5962-00-243-0788
NIINs: 002430788, 002430792, 011737458, 012471358
FSC: 5962 — Microcircuits, Electronic
CAGE: 05869 — RAYTHEON COMPANY DIV RMD STRATEGIC (USA)

SPECIFICATIONS

body_width	0.560 INCHES MAXIMUM IN
body_height	0.180 INCHES MAXIMUM IN
body_length	1.290 INCHES MAXIMUM IN
overall_height	0.300 INCHES NOMINAL IN
memory_capacity	UNKNOWN
features_provided	HERMETICALLY SEALED AND PROGRAMMABLE AND W/RESISTOR AND POSITIVE OUTPUTS
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	8 INPUT
NSN	5962-00-243-0788

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 8 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.560 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.180 INCHES NOMINAL IN

•

FEATURES PROVIDED: PROGRAMMABLE AND MONOLITHIC AND W/ENABLE AND W/RESISTOR

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

OVERALL HEIGHT	0.300 INCHES NOMINAL IN
INPUT CIRCUIT PATTERN	8 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.560 INCHES MAXIMUM IN
BODY HEIGHT	0.180 INCHES NOMINAL IN
FEATURES PROVIDED	PROGRAMMABLE AND MONOLITHIC AND W/ENABLE AND W/RESISTOR
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	ROM
BODY LENGTH	1.290 INCHES MAXIMUM IN

SUBSTITUTES & CROSS-REFERENCES 1

ROM/PROM FAMILY 018Reference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Terminal item — stock exhausted; no further procurementDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is 717382-9?

717382-9 is a MICROCIRCUIT,MEMORY.

What parts can replace 717382-9?

There is 1 known substitute for 717382-9: ROM/PROM FAMILY 018. Substitute compatibility should be verified for your specific system.

What is the NSN for 717382-9?

717382-9 is cataloged in the U.S. Government catalog under NSN 5962-00-243-0788. This indicates validated use in U.S. government and defense supply chains.

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717382-9 — MICROCIRCUIT,MEMORY

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