717382-20 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

717382-20: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.235 INCHES MINIMUM AND 0.293 INCHES MAXIMUM IN, body_height: 0.185 INCHES MAXIMUM IN, body_length: 0.815 INCHES MAXIMUM IN, memory_capacity: UNKNOWN, features_provided: MONOLITHIC AND HERMETICALLY SEALED AND POSITIVE OUTPUTS AND W/STORAGE AND MEDIUM SPEED AND PROGRAMMABLE AND PROGRAMMED, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-021-5877, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

717382-20

NSN: 5962-01-021-5877
FSC: 5962 — Microcircuits, Electronic
CAGE: 05869 — RAYTHEON COMPANY DIV RMD STRATEGIC (USA)

SPECIFICATIONS

body_width	0.235 INCHES MINIMUM AND 0.293 INCHES MAXIMUM IN
body_height	0.185 INCHES MAXIMUM IN
body_length	0.815 INCHES MAXIMUM IN
memory_capacity	UNKNOWN
features_provided	MONOLITHIC AND HERMETICALLY SEALED AND POSITIVE OUTPUTS AND W/STORAGE AND MEDIUM SPEED AND PROGRAMMABLE AND PROGRAMMED
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC AND GLASS
memory_device_type	ROM
storage_temp_range	-60.0 TO 190.0 CELSIUS DEGC
operating_temp_range	+0.0 TO 75.0 CELSIUS DEGC
input_circuit_pattern	10 INPUT
inclosure_configuration	DUAL-IN-LINE
NSN	5962-01-021-5877

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 10 INPUT

•

INCLOSURE MATERIAL: CERAMIC AND GLASS

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.235 INCHES MINIMUM AND 0.293 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.185 INCHES MAXIMUM IN

•

FEATURES PROVIDED: MONOLITHIC AND HERMETICALLY SEALED AND POSITIVE OUTPUTS AND W/STORAGE AND MEDIUM SPEED AND PROGRAMMABLE AND PROGRAMMED

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: ROM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	10 INPUT
INCLOSURE MATERIAL	CERAMIC AND GLASS
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.235 INCHES MINIMUM AND 0.293 INCHES MAXIMUM IN
BODY HEIGHT	0.185 INCHES MAXIMUM IN
FEATURES PROVIDED	MONOLITHIC AND HERMETICALLY SEALED AND POSITIVE OUTPUTS AND W/STORAGE AND MEDIUM SPEED AND PROGRAMMABLE AND PROGRAMMED
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	ROM
BODY LENGTH	0.815 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-60.0 TO 190.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES 1

CB-636Reference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Demilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is 717382-20?

717382-20 is a MICROCIRCUIT,MEMORY.

What parts can replace 717382-20?

There is 1 known substitute for 717382-20: CB-636. Substitute compatibility should be verified for your specific system.

What is the NSN for 717382-20?

717382-20 is cataloged in the U.S. Government catalog under NSN 5962-01-021-5877. This indicates validated use in U.S. government and defense supply chains.

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717382-20 — MICROCIRCUIT,MEMORY

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