717382-116 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

717382-116: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.310 INCHES MAXIMUM IN, body_height: 0.140 INCHES MAXIMUM IN, body_length: 0.840 INCHES MAXIMUM IN, overall_width: 0.320 INCHES MAXIMUM IN, overall_height: 0.400 INCHES MAXIMUM IN, overall_length: 0.840 INCHES MAXIMUM IN. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-296-7601, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

717382-116

NSN: 5962-01-296-7601
FSC: 5962 — Microcircuits, Electronic
CAGE: 05869 — RAYTHEON COMPANY DIV RMD STRATEGIC (USA)

SPECIFICATIONS

body_width	0.310 INCHES MAXIMUM IN
body_height	0.140 INCHES MAXIMUM IN
body_length	0.840 INCHES MAXIMUM IN
overall_width	0.320 INCHES MAXIMUM IN
overall_height	0.400 INCHES MAXIMUM IN
overall_length	0.840 INCHES MAXIMUM IN
features_provided	BIPOLAR AND MONOLITHIC AND PROGRAMMABLE AND SCHOTTKY AND W/CLOCK
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
NSN	5962-01-296-7601

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 11 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.310 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.140 INCHES MAXIMUM IN

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

OVERALL HEIGHT	0.400 INCHES MAXIMUM IN
INPUT CIRCUIT PATTERN	11 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.310 INCHES MAXIMUM IN
BODY HEIGHT	0.140 INCHES MAXIMUM IN
OVERALL LENGTH	0.840 INCHES MAXIMUM IN
OVERALL WIDTH	0.320 INCHES MAXIMUM IN
FEATURES PROVIDED	BIPOLAR AND MONOLITHIC AND PROGRAMMABLE AND SCHOTTKY AND W/CLOCK
INCLOSURE CONFIGURATION	DUAL-IN-LINE

OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic

Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.

5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909

SUBSTITUTES & CROSS-REFERENCES 2

ROM/PROMReference document

Same NSN cross-reference

Reference document — Secondary reference

M38510/20401BEAReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is 717382-116?

717382-116 is a MICROCIRCUIT,MEMORY.

What parts can replace 717382-116?

There are 2 known substitutes for 717382-116: ROM/PROM, M38510/20401BEA. Substitute compatibility should be verified for your specific system.

What is the NSN for 717382-116?

717382-116 is cataloged in the U.S. Government catalog under NSN 5962-01-296-7601. This indicates validated use in U.S. government and defense supply chains.

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717382-116 — MICROCIRCUIT,MEMORY

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