7136341-16-701 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

7136341-16-701: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.300 INCHES MAXIMUM IN, body_height: 0.092 INCHES MAXIMUM IN, body_length: 0.540 INCHES MAXIMUM IN, special_features: ESD, SOFTWARE FILE NO: 8907815-4-701, USING MODULE PMI-803063, CPU/RC 8905830 AND LOCATION U327, features_provided: HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND POSITIVE OUTPUTS, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-391-0609, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

7136341-16-701

NSN: 5962-01-391-0609
FSC: 5962 — Microcircuits, Electronic
CAGE: 06481 — NORTHROP GRUMMAN SYSTEMS CORPORATION DBA NORTHROP GRUMMAN SYSTEMS CORP (USA)

SPECIFICATIONS

body_width	0.300 INCHES MAXIMUM IN
body_height	0.092 INCHES MAXIMUM IN
body_length	0.540 INCHES MAXIMUM IN
special_features	ESD, SOFTWARE FILE NO: 8907815-4-701, USING MODULE PMI-803063, CPU/RC 8905830 AND LOCATION U327
features_provided	HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND POSITIVE OUTPUTS
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC AND GLASS
memory_device_type	PAL
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	16 INPUT
NSN	5962-01-391-0609

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 16 INPUT

•

INCLOSURE MATERIAL: CERAMIC AND GLASS

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.300 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.092 INCHES MAXIMUM IN

•

CRITICALITY CODE JUSTIFICATION: FEAT

•

FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND POSITIVE OUTPUTS

•

INCLOSURE CONFIGURATION: FLAT PACK

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	16 INPUT
INCLOSURE MATERIAL	CERAMIC AND GLASS
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.300 INCHES MAXIMUM IN
BODY HEIGHT	0.092 INCHES MAXIMUM IN
CRITICALITY CODE JUSTIFICATION	FEAT
FEATURES PROVIDED	HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND POSITIVE OUTPUTS
INCLOSURE CONFIGURATION	FLAT PACK
MEMORY DEVICE TYPE	PAL
CASE OUTLINE SOURCE AND DESIGNATOR	F-9 MIL-M-38510

OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic

Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.

5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909

SUBSTITUTES & CROSS-REFERENCES

No substitute or cross-reference records for this part.

LIFECYCLE

NSN statusActive· U.S. Government catalog

No demilitarization required

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FREQUENTLY ASKED QUESTIONS

What is 7136341-16-701?

7136341-16-701 is a MICROCIRCUIT,MEMORY.

What is the NSN for 7136341-16-701?

7136341-16-701 is cataloged in the U.S. Government catalog under NSN 5962-01-391-0609. This indicates validated use in U.S. government and defense supply chains.

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