701802 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

701802: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.526 INCHES MAXIMUM IN, body_height: 0.205 INCHES MAXIMUM IN, body_length: 1.290 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND W/ENABLE AND PROGRAMMABLE AND ERASABLE AND HIGH SPEED AND 3-STATE OUTPUT, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-240-6664, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

701802

NSN: 5962-01-240-6664
NIINs: 012406664, 012406665, 012415589
FSC: 5962 — Microcircuits, Electronic
CAGE: 56183 — TX TECHNOLOGY LLC (USA)

SPECIFICATIONS

body_width	0.526 INCHES MAXIMUM IN
body_height	0.205 INCHES MAXIMUM IN
body_length	1.290 INCHES MAXIMUM IN
features_provided	HERMETICALLY SEALED AND W/ENABLE AND PROGRAMMABLE AND ERASABLE AND HIGH SPEED AND 3-STATE OUTPUT
output_logic_form	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	ROM
storage_temp_range	-65.0 TO 125.0 CELSIUS DEGC
operating_temp_range	-40.0 TO 85.0 CELSIUS DEGC
input_circuit_pattern	14 INPUT
inclosure_configuration	DUAL-IN-LINE
terminal_surface_treatment	SOLDER
NSN	5962-01-240-6664

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 14 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.526 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.205 INCHES MAXIMUM IN

•

FEATURES PROVIDED: HERMETICALLY SEALED AND W/ENABLE AND PROGRAMMABLE AND ERASABLE AND HIGH SPEED AND 3-STATE OUTPUT

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: ROM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	14 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.526 INCHES MAXIMUM IN
BODY HEIGHT	0.205 INCHES MAXIMUM IN
FEATURES PROVIDED	HERMETICALLY SEALED AND W/ENABLE AND PROGRAMMABLE AND ERASABLE AND HIGH SPEED AND 3-STATE OUTPUT
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	ROM
BODY LENGTH	1.290 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 125.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES 2

NMC27C32QE-45Reference document

Same NSN cross-reference

Reference document — Secondary reference

ROM/PROMReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Terminal item — no further procurement; issued until stock is exhaustedNo demilitarization required

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FREQUENTLY ASKED QUESTIONS

What is 701802?

701802 is a MICROCIRCUIT,MEMORY.

What parts can replace 701802?

There are 2 known substitutes for 701802: NMC27C32QE-45, ROM/PROM. Substitute compatibility should be verified for your specific system.

What is the NSN for 701802?

701802 is cataloged in the U.S. Government catalog under NSN 5962-01-240-6664. This indicates validated use in U.S. government and defense supply chains.

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701802 — MICROCIRCUIT,MEMORY

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