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PartsTable / COMPONENT / 7013655P007
7013655P007 ✓ Verified by PartsTable
— · COMPONENT
WHAT YOU NEED TO KNOW
Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel
Confirm exact part number — similar PNs may be different parts
PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.245 INCHES MINIMUM AND 0.300 INCHES MAXIMUM IN, body_height: 0.120 INCHES MINIMUM AND 0.195 INCHES MAXIMUM IN, body_length: 0.750 INCHES MINIMUM AND 0.795 INCHES MAXIMUM IN, memory_capacity: UNKNOWN, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC AND GLASS. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-050-6929, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
7013655P007
NSN: 5962-01-050-6929
FSC: 5962
CAGE: 94117 — BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC. DBA BAE SYSTEMS (USA)
SPECIFICATIONS
body_width0.245 INCHES MINIMUM AND 0.300 INCHES MAXIMUM IN
body_height0.120 INCHES MINIMUM AND 0.195 INCHES MAXIMUM IN
body_length0.750 INCHES MINIMUM AND 0.795 INCHES MAXIMUM IN
memory_capacityUNKNOWN
output_logic_formTRANSISTOR-TRANSISTOR LOGIC
inclosure_materialCERAMIC AND GLASS
memory_device_typePROM
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range+0.0 TO 75.0 CELSIUS DEGC
input_circuit_pattern10 INPUT
inclosure_configurationDUAL-IN-LINE
terminal_surface_treatmentSOLDER
NSN5962-01-050-6929
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 7013655P007 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
OPERATING TEMP RANGE: +0.0 TO 75.0 CELSIUS DEGC
•
FEATURES PROVIDED: HERMETICALLY SEALED AND MONOLITHIC AND W/ENABLE AND HIGH SPEED AND PROGRAMMABLE AND PROGRAMMED AND W/OPEN COLLECTOR AND SCHOTTKY AND BIPOLAR AND W/BUFFERED OUTPUT AND W/DECODED OUTPUT AND EXPANDABLE AND W/DISABLE AND POSITIVE OUTPUTS
•
INCLOSURE MATERIAL: CERAMIC AND GLASS
•
TEST DATA DOCUMENT: 94117-7013655 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING)
•
TIME RATING PER CHACTERISTIC: 75.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT NS
•
TERMINAL TYPE AND QUANTITY: 16 PRINTED CIRCUIT
•
TERMINAL SURFACE TREATMENT: SOLDER
•
MEMORY DEVICE TYPE: PROM
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS (FLIS)
OPERATING TEMP RANGE+0.0 TO 75.0 CELSIUS DEGC
FEATURES PROVIDEDHERMETICALLY SEALED AND MONOLITHIC AND W/ENABLE AND HIGH SPEED AND PROGRAMMABLE AND PROGRAMMED AND W/OPEN COLLECTOR AND SCHOTTKY AND BIPOLAR AND W/BUFFERED OUTPUT AND W/DECODED OUTPUT AND EXPANDABLE AND W/DISABLE AND POSITIVE OUTPUTS
INCLOSURE MATERIALCERAMIC AND GLASS
TEST DATA DOCUMENT94117-7013655 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING)
TIME RATING PER CHACTERISTIC75.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT NS
TERMINAL TYPE AND QUANTITY16 PRINTED CIRCUIT
TERMINAL SURFACE TREATMENTSOLDER
MEMORY DEVICE TYPEPROM
CASE OUTLINE SOURCE AND DESIGNATOR-0-001-AG JOINT ELECTRON DEVICE ENGINEERING COUNCIL
MEMORY CAPACITYUNKNOWN
VERIFIED SUBSTITUTES & CROSS-REFERENCES 18
G705Interchangeable
interchangeable cross-reference
interchangeable
5266329Interchangeable
interchangeable cross-reference
interchangeable
5120PL2060052Interchangeable
interchangeable cross-reference
interchangeable
HPROM1+1024A5Interchangeable
interchangeable cross-reference
interchangeable
HM1-1024A-8Interchangeable
interchangeable cross-reference
interchangeable
HM1-7610-8Interchangeable
interchangeable cross-reference
interchangeable
LIFECYCLE
StatusACTIVE
AvailabilityOEM and secondary market
RoHS CompliantEAR99ESD SensitiveNot HAZMAT
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FREQUENTLY ASKED QUESTIONS
What is 7013655P007?
7013655P007 is a MICROCIRCUIT,MEMORY.
What parts can replace 7013655P007?
There are 18 known substitutes for 7013655P007: G705, 5266329, 5120PL2060052 and 15 more. Substitute compatibility should be verified for your specific system.
What is the NSN for 7013655P007?
7013655P007 is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-050-6929. This indicates validated use in U.S. government and defense supply chains.
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Last verified: July 2026