7011664: CIRCUIT CARD ASSEMBLY.
The CIRCUIT CARD ASSEMBLY is a the manufacturer industrial component. Key specifications include overall_width: 4.500 INCHES NOMINAL IN, overall_height: 0.375 INCHES MAXIMUM IN, overall_length: 8.400 INCHES NOMINAL IN, special_features: THIS MODULE MAY CONTAIN TIN/LEAD TO TIN/LEAD OR TIN/LEAD TO GOLD INTERCONECTIONS, features_provided: ELECTROSTATIC SENSITIVE, end_item_identification: ORDALT 20285,AWS PROM MDL(MX-10406)DDG64 ONLY;ORDALT 20285,AEGIS PROM MAMS,DDG64 ONLY. This part is cataloged in the U.S.
Government catalog under NSN 5998-01-490-5531, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| overall_width | 4.500 INCHES NOMINAL IN |
| overall_height | 0.375 INCHES MAXIMUM IN |
| overall_length | 8.400 INCHES NOMINAL IN |
| special_features | THIS MODULE MAY CONTAIN TIN/LEAD TO TIN/LEAD OR TIN/LEAD TO GOLD INTERCONECTIONS |
| features_provided | ELECTROSTATIC SENSITIVE |
| end_item_identification | ORDALT 20285,AWS PROM MDL(MX-10406)DDG64 ONLY;ORDALT 20285,AEGIS PROM MAMS,DDG64 ONLY |
| NSN | 5998-01-490-5531 |
| OVERALL HEIGHT | 0.375 INCHES MAXIMUM IN |
| OVERALL LENGTH | 8.400 INCHES NOMINAL IN |
| OVERALL WIDTH | 4.500 INCHES NOMINAL IN |
| FEATURES PROVIDED | ELECTROSTATIC SENSITIVE |
| SPECIAL FEATURES | THIS MODULE MAY CONTAIN TIN/LEAD TO TIN/LEAD OR TIN/LEAD TO GOLD INTERCONECTIONS |
| END ITEM IDENTIFICATION | ORDALT 20285,AWS PROM MDL(MX-10406)DDG64 ONLY;ORDALT 20285,AEGIS PROM MAMS,DDG64 ONLY |
No substitute or cross-reference records for this part.