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Technical Data Sheet
69236200-01 ✓ Verified by PartsTable
· COMPONENT
WHAT YOU NEED TO KNOW
Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel
Confirm exact part number — similar PNs may be different parts
PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.300 INCHES MAXIMUM IN, body_height: 0.200 INCHES MAXIMUM IN, body_length: 0.870 INCHES NOMINAL IN, features_provided: BIPOLAR AND PROGRAMMABLE AND HERMETICALLY SEALED, inclosure_material: CERAMIC, memory_device_type: ROM. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-00-448-1874, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
69236200-01
NSN: 5962-00-448-1874
FSC: 5962
CAGE: 27963 — GENERAL DYNAMICS INFORMATION SYSTEMS INC. DBA GENERAL DYNAMICS ADVANCED INFORMATION SYSTEMS (USA)
SPECIFICATIONS
body_width0.300 INCHES MAXIMUM IN
body_height0.200 INCHES MAXIMUM IN
body_length0.870 INCHES NOMINAL IN
features_providedBIPOLAR AND PROGRAMMABLE AND HERMETICALLY SEALED
inclosure_materialCERAMIC
memory_device_typeROM
operating_temp_range+0.0 TO 70.0 CELSIUS DEGC
inclosure_configurationDUAL-IN-LINE
terminal_surface_treatmentSOLDER
terminal_type_and_quantity16 PRINTED CIRCUIT
NSN5962-00-448-1874
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 69236200-01 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
INCLOSURE CONFIGURATION: DUAL-IN-LINE
TERMINAL TYPE AND QUANTITY: 16 PRINTED CIRCUIT
MEMORY DEVICE TYPE: ROM
TERMINAL SURFACE TREATMENT: SOLDER
INCLOSURE MATERIAL: CERAMIC
OPERATING TEMP RANGE: +0.0 TO 70.0 CELSIUS DEGC
BODY WIDTH: 0.300 INCHES MAXIMUM IN
FEATURES PROVIDED: BIPOLAR AND PROGRAMMABLE AND HERMETICALLY SEALED
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS (FLIS)
INCLOSURE CONFIGURATIONDUAL-IN-LINE
TERMINAL TYPE AND QUANTITY16 PRINTED CIRCUIT
MEMORY DEVICE TYPEROM
TERMINAL SURFACE TREATMENTSOLDER
INCLOSURE MATERIALCERAMIC
OPERATING TEMP RANGE+0.0 TO 70.0 CELSIUS DEGC
BODY WIDTH0.300 INCHES MAXIMUM IN
FEATURES PROVIDEDBIPOLAR AND PROGRAMMABLE AND HERMETICALLY SEALED
BODY HEIGHT0.200 INCHES MAXIMUM IN
BODY LENGTH0.870 INCHES NOMINAL IN
VERIFIED SUBSTITUTES & CROSS-REFERENCES 11
85623300-01Interchangeable
interchangeable cross-reference
interchangeable
69020700-01Interchangeable
interchangeable cross-reference
interchangeable
HM17610-5Interchangeable
interchangeable cross-reference
interchangeable
85623400-01Interchangeable
interchangeable cross-reference
interchangeable
ROM/PROM FAMILY 021Interchangeable
interchangeable cross-reference
interchangeable
85623500-01Interchangeable
interchangeable cross-reference
interchangeable
LIFECYCLE
StatusACTIVE
AvailabilityOEM and secondary market
RoHS CompliantEAR99ESD SensitiveNot HAZMAT
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FREQUENTLY ASKED QUESTIONS
What is 69236200-01?
69236200-01 is a MICROCIRCUIT,MEMORY.
What parts can replace 69236200-01?
There are 11 known substitutes for 69236200-01: 85623300-01, 69020700-01, HM17610-5 and 8 more. Substitute compatibility should be verified for your specific system.
What is the NSN for 69236200-01?
69236200-01 is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-00-448-1874. This indicates validated use in U.S. government and defense supply chains.
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