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681838-11 — MICROCIRCUIT,MEMORY

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

681838-11: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include features_provided: HERMETICALLY SEALED AND BURN IN AND PROGRAMMED, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC, memory_device_type: PAL, test_data_document: 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.)., operating_temp_range: -55.0 TO 125.0 CELSIUS DEGC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-396-4524, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
681838-11
NSN: 5962-01-396-4524
FSC: 5962 — Microcircuits, Electronic
CAGE: 98255 — DRS SUSTAINMENT SYSTEMS INC (USA)
SPECIFICATIONS
features_providedHERMETICALLY SEALED AND BURN IN AND PROGRAMMED
output_logic_formCOMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_materialCERAMIC
memory_device_typePAL
test_data_document96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
inclosure_configurationLEADED CHIP CARRIER
terminal_surface_treatmentSOLDER
terminal_type_and_quantity28 J-HOOK
time_rating_per_chacteristic15.00 NANOSECONDS MAXIMUM ACCESS NS
case_outline_source_and_designatorC-4 MIL-M-38510
voltage_rating_and_type_per_characteristic7.0 VOLTS MAXIMUM POWER SOURCE
NSN5962-01-396-4524
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 681838-11 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
INCLOSURE MATERIAL: CERAMIC
•
TERMINAL SURFACE TREATMENT: SOLDER
•
FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND PROGRAMMED
•
INCLOSURE CONFIGURATION: LEADED CHIP CARRIER
•
MEMORY DEVICE TYPE: PAL
•
CASE OUTLINE SOURCE AND DESIGNATOR: C-4 MIL-M-38510
•
OUTPUT LOGIC FORM: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
•
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 7.0 VOLTS MAXIMUM POWER SOURCE
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
INCLOSURE MATERIALCERAMIC
TERMINAL SURFACE TREATMENTSOLDER
FEATURES PROVIDEDHERMETICALLY SEALED AND BURN IN AND PROGRAMMED
INCLOSURE CONFIGURATIONLEADED CHIP CARRIER
MEMORY DEVICE TYPEPAL
CASE OUTLINE SOURCE AND DESIGNATORC-4 MIL-M-38510
OUTPUT LOGIC FORMCOMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
VOLTAGE RATING AND TYPE PER CHARACTERISTIC7.0 VOLTS MAXIMUM POWER SOURCE
OPERATING TEMP RANGE-55.0 TO 125.0 CELSIUS DEGC
TEST DATA DOCUMENT96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
SUBSTITUTES & CROSS-REFERENCES 2
ROM/PROMReference document
Same NSN cross-reference
Reference document — Secondary reference
5962-88670053AReference document
Same NSN cross-reference
Reference document — Secondary reference
LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Insurance item — stocked against contingency demandNo demilitarization required
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FREQUENTLY ASKED QUESTIONS
What is 681838-11?
681838-11 is a MICROCIRCUIT,MEMORY.
What parts can replace 681838-11?
There are 2 known substitutes for 681838-11: ROM/PROM, 5962-88670053A. Substitute compatibility should be verified for your specific system.
What is the NSN for 681838-11?
681838-11 is cataloged in the U.S. Government catalog under NSN 5962-01-396-4524. This indicates validated use in U.S. government and defense supply chains.
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