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659-0319-003 — MICROCIRCUIT,MEMORY

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

659-0319-003: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.245 INCHES MINIMUM AND 0.285 INCHES MAXIMUM IN, body_height: 0.078 INCHES MINIMUM AND 0.250 INCHES MAXIMUM IN, body_length: 0.935 INCHES MINIMUM AND 0.970 INCHES MAXIMUM IN, bit_quantity: 16384, word_quantity: 4096, overall_height: 0.255 INCHES MINIMUM AND 0.360 INCHES MAXIMUM IN. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-233-8147, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
659-0319-003
NSN: 5962-01-233-8147
FSC: 5962 — Microcircuits, Electronic
CAGE: 13499 — ROCKWELL COLLINS, INC. DBA COLLINS AEROSPACE GOVERNMENT SYSTEMS DIV COLLINS AEROSPACE - GOVERNMENT SYSTEMS (USA)
SPECIFICATIONS
body_width0.245 INCHES MINIMUM AND 0.285 INCHES MAXIMUM IN
body_height0.078 INCHES MINIMUM AND 0.250 INCHES MAXIMUM IN
body_length0.935 INCHES MINIMUM AND 0.970 INCHES MAXIMUM IN
bit_quantity16384
word_quantity4096
overall_height0.255 INCHES MINIMUM AND 0.360 INCHES MAXIMUM IN
memory_capacityUNKNOWN
features_providedMONOLITHIC AND PROGRAMMABLE AND POSITIVE OUTPUTS
output_logic_formTRANSISTOR-TRANSISTOR LOGIC
inclosure_materialCERAMIC
memory_device_typeROM
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
NSN5962-01-233-8147
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 659-0319-003 MFR MICROCIRCUIT,MEMORY
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
SUBSTITUTES & CROSS-REFERENCES 6
53S1641J/883BReference document
Same NSN cross-reference
Reference document — Secondary reference
AM27S41DMBReference document
Same NSN cross-reference
Reference document — Secondary reference
351-5666-012Reference document
Same NSN cross-reference
Reference document — Secondary reference
613-0942-003Reference document
Same NSN cross-reference
Reference document — Secondary reference
ROM/PROM FAMILY 085Reference document
Same NSN cross-reference
Reference document — Secondary reference
M2764-45/BReference document
Same NSN cross-reference
Reference document — Secondary reference
LIFECYCLE
NSN statusActive· U.S. Government catalog
Demilitarization required — mutilation + specific procedure
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FREQUENTLY ASKED QUESTIONS
What is 659-0319-003?
659-0319-003 is a MICROCIRCUIT,MEMORY.
What parts can replace 659-0319-003?
There are 6 known substitutes for 659-0319-003: 53S1641J/883B, AM27S41DMB, 351-5666-012 and 3 more. Substitute compatibility should be verified for your specific system.
What is the NSN for 659-0319-003?
659-0319-003 is cataloged in the U.S. Government catalog under NSN 5962-01-233-8147. This indicates validated use in U.S. government and defense supply chains.
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