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655409-571 — HP 655409-571 memory module 2 GB DDR3 240-pin DIMM

✓ Government record, cited
HPE · MRO · MRO_GENERAL
PRODUCT OVERVIEW

655409-571: HP 655409-571 memory module 2 GB DDR3 240-pin DIMM.

HP 655409-571 memory module 2 GB DDR3 240-pin DIMM. Key specifications include special_features: NON-ECC MEMORY UPGRADE KIT; INTERNAL MEMORY: 4GB, TYPE DDR3, 1600 MHZ; OPERATING TEMPERATURE RANGE: 0-85 DEG C GB, end_item_identification: 534071-01(29355) SERVER, DBM Z220, part_name_assigned_by_controlling_agency: 4GB (2X2GB) DDR3-1600 NECC GB. This part is cataloged in the U.S.

Government catalog under NSN 7025-01-627-6669, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
MRO→ MRO_GENERAL→ 655409-571
NSN: 7025-01-627-6669
FSC: 7025 — Information Technology Input/output and Storage Devices
CAGE: 28480 — HEWLETT-PACKARD COMPANY DBA HP (USA)
SPECIFICATIONS
special_featuresNON-ECC MEMORY UPGRADE KIT; INTERNAL MEMORY: 4GB, TYPE DDR3, 1600 MHZ; OPERATING TEMPERATURE RANGE: 0-85 DEG C GB
end_item_identification534071-01(29355) SERVER, DBM Z220
part_name_assigned_by_controlling_agency4GB (2X2GB) DDR3-1600 NECC GB
NSN7025-01-627-6669
MORE FROM HPE
Popular HPE machine pages — browsing only, not a fit claim for 655409-571.
COMPONENT DIAGRAM
ECC 2GB 2Rx4 PC3 — RDIMM HPE NOTCH ~133.35 mm DDR3 RDIMM | 2GB | — | PC3 Notch position = DDR3 generation | DDR3/DDR4/DDR5 physically incompatible RDIMM = Registered (servers) | LRDIMM = Load-Reduced | UDIMM = Unbuffered TITLE DDR3 RDIMM PN 655409-571 MFR HPE 2GB —
KEY FEATURES
•
DDR3 Interface
•
2GB Capacity
•
DDR3 Memory
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
SPECIAL FEATURESNON-ECC MEMORY UPGRADE KIT; INTERNAL MEMORY: 4GB, TYPE DDR3, 1600 MHZ; OPERATING TEMPERATURE RANGE: 0-85 DEG C GB
PART NAME ASSIGNED BY CONTROLLING AGENCY4GB (2X2GB) DDR3-1600 NECC GB
END ITEM IDENTIFICATION534071-01(29355) SERVER, DBM Z220
OTHER ITEMS IN FSC 7025 — Information Technology Input/output and Storage Devices
Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.
7025-00-001-2681 7025-00-001-5588 7025-00-001-6998 7025-00-001-6999 7025-00-001-7000 7025-00-001-7025 7025-00-001-7026 7025-00-001-7027
SUBSTITUTES & CROSS-REFERENCES 3
B1S52AACompatiblePARTNER
HP 2Gb PC3-12800U 1600Mhz Non-ECC UB SR x8 CAS-11 DIMM for Z1/Z220
compatible
683863-001CompatiblePARTNER
HP 2Gb PC3-12800U 1600Mhz Non-ECC UB SR x8 CAS-11 (256Mx8) DIMM - Intel - WS
compatible
A2H26AVCompatiblePARTNER
HP 2Gb PC3-12800U 1600Mhz Non-ECC UB SR x8 CAS-11 DIMM for Z1
compatible
LIFECYCLE
NSN statusActive· U.S. Government catalog
No demilitarization required
THIS PART SUBSTITUTES FOR 3
A2H26AVSUBSTITUTE
HP 2Gb PC3-12800U 1600Mhz Non-ECC UB SR x8 CAS-11 (256Mx8) DIMM - Intel - WS
HP
B1S52AASUBSTITUTE
HP 2Gb PC3-12800U 1600Mhz Non-ECC UB SR x8 CAS-11 (256Mx8) DIMM - Intel - WS
HP
683863-001SUBSTITUTE
HP 2Gb PC3-12800U 1600Mhz Non-ECC UB SR x8 CAS-11 (256Mx8) DIMM - Intel - WS
HP
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FREQUENTLY ASKED QUESTIONS
What is 655409-571?
655409-571 is a HP 655409-571 memory module 2 GB DDR3 240-pin DIMM manufactured by HPE. It is classified as a MRO (MRO_GENERAL).
What parts can replace 655409-571?
There are 3 known substitutes for 655409-571: B1S52AA, 683863-001, A2H26AV. Substitute compatibility should be verified for your specific system.
What is the NSN for 655409-571?
655409-571 is cataloged in the U.S. Government catalog under NSN 7025-01-627-6669. This indicates validated use in U.S. government and defense supply chains.
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