6553-018 — MICROCIRCUIT,DIGITAL

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

6553-018: MICROCIRCUIT,DIGITAL.

The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.458 INCHES MAXIMUM IN, body_height: 0.100 INCHES MAXIMUM IN, body_length: 0.458 INCHES MAXIMUM IN, features_provided: ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND BURN IN AND W/CLOCK, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-230-3023, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

6553-018

NSN: 5962-01-230-3023
FSC: 5962 — Microcircuits, Electronic
CAGE: 31471 — SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC DBA ON SEMICONDUCTOR DIV POCATELLO ID MANUFACTURING FACILITY (USA)

SPECIFICATIONS

body_width	0.458 INCHES MAXIMUM IN
body_height	0.100 INCHES MAXIMUM IN
body_length	0.458 INCHES MAXIMUM IN
features_provided	ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND BURN IN AND W/CLOCK
output_logic_form	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	15 INPUT
inclosure_configuration	LEADLESS FLAT PACK
terminal_surface_treatment	SOLDER
NSN	5962-01-230-3023

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 15 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

DESIGN FUNCTION AND QUANTITY: 1 TIMER

•

BODY WIDTH: 0.458 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.100 INCHES MAXIMUM IN

•

FEATURES PROVIDED: ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND BURN IN AND W/CLOCK

•

INCLOSURE CONFIGURATION: LEADLESS FLAT PACK

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	15 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
DESIGN FUNCTION AND QUANTITY	1 TIMER
BODY WIDTH	0.458 INCHES MAXIMUM IN
BODY HEIGHT	0.100 INCHES MAXIMUM IN
FEATURES PROVIDED	ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND BURN IN AND W/CLOCK
INCLOSURE CONFIGURATION	LEADLESS FLAT PACK
CASE OUTLINE SOURCE AND DESIGNATOR	C-4 MIL-M-38510
BODY LENGTH	0.458 INCHES MAXIMUM IN

SUBSTITUTES & CROSS-REFERENCES 8

5962-95A0301M3BReference document

Same NSN cross-reference

Reference document — Secondary reference

5962-95A0301M3AReference document

Same NSN cross-reference

Reference document — Secondary reference

5962-95A03Reference document

Same NSN cross-reference

Reference document — Identification reference

5962-ASICReference document

Same NSN cross-reference

Reference document — Secondary reference

5962-95A0301Q3ASame NSN cross-reference

Same NSN cross-reference

Also cataloged under this NSN

5962-95A0301M3XReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusCancelled· U.S. Government catalog

Demilitarization required — mutilation + specific procedure

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FREQUENTLY ASKED QUESTIONS

What is 6553-018?

6553-018 is a MICROCIRCUIT,DIGITAL.

What parts can replace 6553-018?

There are 8 known substitutes for 6553-018: 5962-95A0301M3B, 5962-95A0301M3A, 5962-95A03 and 5 more. Substitute compatibility should be verified for your specific system.

What is the NSN for 6553-018?

6553-018 is cataloged in the U.S. Government catalog under NSN 5962-01-230-3023. This indicates validated use in U.S. government and defense supply chains.

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6553-018 — MICROCIRCUIT,DIGITAL

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