Name: MICROCIRCUIT,MEMORY
Brand: Unknown
SKU: 652-2150-003

652-2150-003 ✓ Verified by PartsTable

— · COMPONENT

WHAT YOU NEED TO KNOW

Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel

Confirm exact part number — similar PNs may be different parts

PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.600 INCHES MAXIMUM IN, body_height: 0.180 INCHES MAXIMUM IN, body_length: 1.415 INCHES MAXIMUM IN, memory_capacity: UNKNOWN, features_provided: ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND ERASABLE, output_logic_form: N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-260-3896, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

652-2150-003

NSN: 5962-01-260-3896
FSC: 5962
CAGE: 13499 — ROCKWELL COLLINS, INC. DBA COLLINS AEROSPACE GOVERNMENT SYSTEMS DIV COLLINS AEROSPACE - GOVERNMENT SYSTEMS (USA)

SPECIFICATIONS

body_width	0.600 INCHES MAXIMUM IN
body_height	0.180 INCHES MAXIMUM IN
body_length	1.415 INCHES MAXIMUM IN
memory_capacity	UNKNOWN
features_provided	ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND ERASABLE
output_logic_form	N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	17 INPUT
NSN	5962-01-260-3896

COMPONENT DIAGRAM

KEY FEATURES

•

BODY HEIGHT: 0.180 INCHES MAXIMUM IN

•

FEATURES PROVIDED: ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND ERASABLE

•

TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).

•

TERMINAL TYPE AND QUANTITY: 28 PRINTED CIRCUIT

•

MEMORY CAPACITY: UNKNOWN

•

TIME RATING PER CHACTERISTIC: 350.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 350.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS

•

MEMORY DEVICE TYPE: ROM

•

VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 5.0 VOLTS MAXIMUM POWER SOURCE

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS (FLIS)

BODY HEIGHT	0.180 INCHES MAXIMUM IN
FEATURES PROVIDED	ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND ERASABLE
TEST DATA DOCUMENT	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
TERMINAL TYPE AND QUANTITY	28 PRINTED CIRCUIT
MEMORY CAPACITY	UNKNOWN
TIME RATING PER CHACTERISTIC	350.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 350.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS
MEMORY DEVICE TYPE	ROM
VOLTAGE RATING AND TYPE PER CHARACTERISTIC	5.0 VOLTS MAXIMUM POWER SOURCE
TERMINAL SURFACE TREATMENT	SOLDER
OPERATING TEMP RANGE	-55.0 TO 125.0 CELSIUS DEGC

VERIFIED SUBSTITUTES & CROSS-REFERENCES 6

84111Interchangeable

interchangeable cross-reference

interchangeable

8411101YXInterchangeable

interchangeable cross-reference

interchangeable

MD27256-35Interchangeable

interchangeable cross-reference

interchangeable

ROM/PROMInterchangeable

Same NIIN cross-reference

interchangeable

091-0176-003Interchangeable

Same NIIN cross-reference

interchangeable

MD27256-35/BInterchangeable

Same NIIN cross-reference

interchangeable

LIFECYCLE

StatusACTIVE

AvailabilityOEM and secondary market

RoHS CompliantEAR99ESD SensitiveNot HAZMAT

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FREQUENTLY ASKED QUESTIONS

What is 652-2150-003?

652-2150-003 is a MICROCIRCUIT,MEMORY.

What parts can replace 652-2150-003?

There are 6 known substitutes for 652-2150-003: 84111, 8411101YX, MD27256-35 and 3 more. Substitute compatibility should be verified for your specific system.

What is the NSN for 652-2150-003?

652-2150-003 is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-260-3896. This indicates validated use in U.S. government and defense supply chains.

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