65-00-T660-0030: INSULATING COMPOUND,THERMAL.
The INSULATING COMPOUND,THERMAL is a the manufacturer industrial component. Key specifications include material: SILICONE, usage_design: FOR EXTREMELY LOW THERMAL IMPEDANCE AT THINNER BONDLINE THICKNESSES (SOMETIMES BELOW 1 MIL), curing_method: HEAT, physical_form: SOLID, part_name_assigned_by_controlling_agency: THERMAL GREASE. This part is cataloged in the U.S.
Government catalog under NSN 8030-01-629-4132, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | SILICONE |
| usage_design | FOR EXTREMELY LOW THERMAL IMPEDANCE AT THINNER BONDLINE THICKNESSES (SOMETIMES BELOW 1 MIL) |
| curing_method | HEAT |
| physical_form | SOLID |
| part_name_assigned_by_controlling_agency | THERMAL GREASE |
| NSN | 8030-01-629-4132 |
| CURING METHOD | HEAT |
| PHYSICAL FORM | SOLID |
| COLOR | GRAY, LIGHT |
| SPECIAL FEATURES | SILICONE BASED THERMAL GREASE THAT CONDUCTS HEAT BETWEEN HOT COPONENT AND A HEAT SINK OR ENCLOSURE; FILLS INTERFACE VARIABLE TOLERANCES IN ELECTRONICS ASSEMBLIES AND HEAT SINK APPLICATIONS; NON CURING, DISPENSABLE, HIGHLY CONFORMABLE MATERIALS REQUIRE NO CURE CYCLE, MIXING OR REFRIGERATION; THERMALLY STABLE AND REQUIRE VIRTUALLY NO COMPRESSIVE FORCE TO DEFORM UNDER ASSEMBLY PRESSURE; MEET THE NEED FOR HIGH POWER APPLICATIONS REQUIRING MATERIAL WITH MINIMUM BOND LINE THICKNESS AND HIGH CONDUCTIVITY; IDEAL FOR REWORK AND FIELD REPAIR SITUATIONS; OPERATING TEMP RANGE-MINUS 55C TO 200C |
| PART NAME ASSIGNED BY CONTROLLING AGENCY | THERMAL GREASE |
| MATERIAL | SILICONE |
| USAGE DESIGN | FOR EXTREMELY LOW THERMAL IMPEDANCE AT THINNER BONDLINE THICKNESSES (SOMETIMES BELOW 1 MIL) |
No substitute or cross-reference records for this part.