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645618-901 — MICROCIRCUIT,MEMORY

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

645618-901: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include features_provided: HERMETICALLY SEALED AND BURN IN, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: SILICON, memory_device_type: PROM, storage_temp_range: -65.0 TO 150.0 CELSIUS DEGC, operating_temp_range: -55.0 TO 125.0 CELSIUS DEGC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-232-9087, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
645618-901
NSN: 5962-01-232-9087
FSC: 5962 — Microcircuits, Electronic
CAGE: 37695 — RAYTHEON COMPANY (USA)
SPECIFICATIONS
features_providedHERMETICALLY SEALED AND BURN IN
output_logic_formTRANSISTOR-TRANSISTOR LOGIC
inclosure_materialSILICON
memory_device_typePROM
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
end_item_identificationAIRCRAFT P-3
inclosure_configurationDUAL-IN-LINE
NSN5962-01-232-9087
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 645618-901 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
INCLOSURE MATERIAL: SILICON
•
FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN
•
INCLOSURE CONFIGURATION: DUAL-IN-LINE
•
MEMORY DEVICE TYPE: PROM
•
STORAGE TEMP RANGE: -65.0 TO 150.0 CELSIUS DEGC
•
OUTPUT LOGIC FORM: TRANSISTOR-TRANSISTOR LOGIC
•
OPERATING TEMP RANGE: -55.0 TO 125.0 CELSIUS DEGC
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
INCLOSURE MATERIALSILICON
FEATURES PROVIDEDHERMETICALLY SEALED AND BURN IN
INCLOSURE CONFIGURATIONDUAL-IN-LINE
MEMORY DEVICE TYPEPROM
STORAGE TEMP RANGE-65.0 TO 150.0 CELSIUS DEGC
OUTPUT LOGIC FORMTRANSISTOR-TRANSISTOR LOGIC
OPERATING TEMP RANGE-55.0 TO 125.0 CELSIUS DEGC
END ITEM IDENTIFICATIONAIRCRAFT P-3
OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic
Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.
5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909
SUBSTITUTES & CROSS-REFERENCES 1
ROM/PROMReference document
Same NSN cross-reference
Reference document — Secondary reference
LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure
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FREQUENTLY ASKED QUESTIONS
What is 645618-901?
645618-901 is a MICROCIRCUIT,MEMORY.
What parts can replace 645618-901?
There is 1 known substitute for 645618-901: ROM/PROM. Substitute compatibility should be verified for your specific system.
What is the NSN for 645618-901?
645618-901 is cataloged in the U.S. Government catalog under NSN 5962-01-232-9087. This indicates validated use in U.S. government and defense supply chains.
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