642AS3737-118 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

642AS3737-118: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.220 INCHES MINIMUM AND 0.280 INCHES MAXIMUM IN, body_height: 0.185 INCHES NOMINAL IN, body_length: 0.870 INCHES MAXIMUM IN, features_provided: PROGRAMMABLE, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-102-1235, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

642AS3737-118

NSN: 5962-01-102-1235
FSC: 5962 — Microcircuits, Electronic
CAGE: 30003 — NAVAL AIR SYSTEMS COMMAND MANAGED ORIGINAL DESIGN ACTIVITY NOT MATERIAL/PARTS SUPPLIER (USA)

SPECIFICATIONS

body_width	0.220 INCHES MINIMUM AND 0.280 INCHES MAXIMUM IN
body_height	0.185 INCHES NOMINAL IN
body_length	0.870 INCHES MAXIMUM IN
features_provided	PROGRAMMABLE
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	8 INPUT
inclosure_configuration	DUAL-IN-LINE
terminal_surface_treatment	SOLDER
NSN	5962-01-102-1235

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 8 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.220 INCHES MINIMUM AND 0.280 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.185 INCHES NOMINAL IN

•

FEATURES PROVIDED: PROGRAMMABLE

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: ROM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	8 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.220 INCHES MINIMUM AND 0.280 INCHES MAXIMUM IN
BODY HEIGHT	0.185 INCHES NOMINAL IN
FEATURES PROVIDED	PROGRAMMABLE
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	ROM
BODY LENGTH	0.870 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES 2

HPROM1-1024-2B-B1004Reference document

Same NSN cross-reference

Reference document — Secondary reference

ROM/PROM FAMILY 005Reference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is 642AS3737-118?

642AS3737-118 is a MICROCIRCUIT,MEMORY.

What parts can replace 642AS3737-118?

There are 2 known substitutes for 642AS3737-118: HPROM1-1024-2B-B1004, ROM/PROM FAMILY 005. Substitute compatibility should be verified for your specific system.

What is the NSN for 642AS3737-118?

642AS3737-118 is cataloged in the U.S. Government catalog under NSN 5962-01-102-1235. This indicates validated use in U.S. government and defense supply chains.

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