6414837-8 — Technical Data Sheet

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— · COMPONENT

WHAT YOU NEED TO KNOW

Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel

Confirm exact part number — similar PNs may be different parts

PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN, body_height: 0.172 INCHES MINIMUM AND 0.217 INCHES MAXIMUM IN, body_length: 1.490 INCHES MAXIMUM IN, overall_height: 0.432 INCHES MAXIMUM IN, memory_capacity: UNKNOWN, features_provided: HERMETICALLY SEALED AND BURN IN AND ULTRAVIOLET ERASABLE AND W/ENABLE AND PROGRAMMED AND ELECTROSTATIC SENSITIVE. This part is cataloged in the Federal Logistics Information System under NSN 5962-01-341-0833, indicating validated use in U.S.

government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels. Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

6414837-8

NSN: 5962-01-341-0833
FSC: 5962
CAGE: 55974 — HONEYWELL INTL INC DEFENSE AVIONICS SYSTEMS FORMER TEST SYSTEMS DIV (USA)

SPECIFICATIONS

body_width	0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN
body_height	0.172 INCHES MINIMUM AND 0.217 INCHES MAXIMUM IN
body_length	1.490 INCHES MAXIMUM IN
overall_height	0.432 INCHES MAXIMUM IN
memory_capacity	UNKNOWN
features_provided	HERMETICALLY SEALED AND BURN IN AND ULTRAVIOLET ERASABLE AND W/ENABLE AND PROGRAMMED AND ELECTROSTATIC SENSITIVE
output_logic_form	N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	EPROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
NSN	5962-01-341-0833

COMPONENT DIAGRAM

KEY FEATURES

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MAXIMUM POWER DISSIPATION RATING: 1.0 WATTS

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INPUT CIRCUIT PATTERN: 25 INPUT

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BODY LENGTH: 1.490 INCHES MAXIMUM IN

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TERMINAL SURFACE TREATMENT: SOLDER

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VOLTAGE RATING AND TYPE PER CHARACTERISTIC: -0.6 VOLTS MINIMUM POWER SOURCE AND 6.25 VOLTS MAXIMUM POWER SOURCE

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TERMINAL TYPE AND QUANTITY: 28 PRINTED CIRCUIT

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MEMORY CAPACITY: UNKNOWN

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CURRENT RATING PER CHARACTERISTIC: 125.00 MILLIAMPERES MAXIMUM SUPPLY

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

MAXIMUM POWER DISSIPATION RATING	1.0 WATTS
INPUT CIRCUIT PATTERN	25 INPUT
BODY LENGTH	1.490 INCHES MAXIMUM IN
TERMINAL SURFACE TREATMENT	SOLDER
VOLTAGE RATING AND TYPE PER CHARACTERISTIC	-0.6 VOLTS MINIMUM POWER SOURCE AND 6.25 VOLTS MAXIMUM POWER SOURCE
TERMINAL TYPE AND QUANTITY	28 PRINTED CIRCUIT
MEMORY CAPACITY	UNKNOWN
CURRENT RATING PER CHARACTERISTIC	125.00 MILLIAMPERES MAXIMUM SUPPLY
TEST DATA DOCUMENT	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
MEMORY DEVICE TYPE	EPROM

VERIFIED SUBSTITUTES & CROSS-REFERENCES 11

M38510/22401BYXInterchangeableGOVERNMENT REGISTRY