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64-0009-001 — MICROCIRCUIT,MEMORY

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

64-0009-001: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.560 INCHES MINIMUM AND 0.600 INCHES MAXIMUM IN, body_height: 0.080 INCHES MINIMUM AND 0.130 INCHES MAXIMUM IN, body_length: 1.180 INCHES MINIMUM AND 1.220 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND MONOLITHIC AND PROGRAMMABLE, output_logic_form: METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC AND GLASS. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-135-5488, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
64-0009-001
NSN: 5962-01-135-5488
FSC: 5962 — Microcircuits, Electronic
CAGE: 21562 — GENERAL DYNAMICS OTS (AEROSPACE), INC. DBA GENERAL DYNAMICS ORDINANCE AND TACTICAL SYSTEMS DIV SEATTLE OPERATIONS (USA)
SPECIFICATIONS
body_width0.560 INCHES MINIMUM AND 0.600 INCHES MAXIMUM IN
body_height0.080 INCHES MINIMUM AND 0.130 INCHES MAXIMUM IN
body_length1.180 INCHES MINIMUM AND 1.220 INCHES MAXIMUM IN
features_providedHERMETICALLY SEALED AND MONOLITHIC AND PROGRAMMABLE
output_logic_formMETAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_materialCERAMIC AND GLASS
memory_device_typeROM
storage_temp_range-65.0 TO 125.0 CELSIUS DEGC
operating_temp_range-55.0 TO 70.0 CELSIUS DEGC
input_circuit_pattern8 INPUT
end_item_identification4920-01-054-8585 81755
inclosure_configurationDUAL-IN-LINE
NSN5962-01-135-5488
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 64-0009-001 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
INPUT CIRCUIT PATTERN: 8 INPUT
•
INCLOSURE MATERIAL: CERAMIC AND GLASS
•
TERMINAL SURFACE TREATMENT: SOLDER
•
BODY WIDTH: 0.560 INCHES MINIMUM AND 0.600 INCHES MAXIMUM IN
•
BODY HEIGHT: 0.080 INCHES MINIMUM AND 0.130 INCHES MAXIMUM IN
•
FEATURES PROVIDED: HERMETICALLY SEALED AND MONOLITHIC AND PROGRAMMABLE
•
INCLOSURE CONFIGURATION: DUAL-IN-LINE
•
MEMORY DEVICE TYPE: ROM
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
INPUT CIRCUIT PATTERN8 INPUT
INCLOSURE MATERIALCERAMIC AND GLASS
TERMINAL SURFACE TREATMENTSOLDER
BODY WIDTH0.560 INCHES MINIMUM AND 0.600 INCHES MAXIMUM IN
BODY HEIGHT0.080 INCHES MINIMUM AND 0.130 INCHES MAXIMUM IN
FEATURES PROVIDEDHERMETICALLY SEALED AND MONOLITHIC AND PROGRAMMABLE
INCLOSURE CONFIGURATIONDUAL-IN-LINE
MEMORY DEVICE TYPEROM
BODY LENGTH1.180 INCHES MINIMUM AND 1.220 INCHES MAXIMUM IN
STORAGE TEMP RANGE-65.0 TO 125.0 CELSIUS DEGC
OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic
Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.
5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909
SUBSTITUTES & CROSS-REFERENCES

No substitute or cross-reference records for this part.

LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Terminal item — no further procurement; issued until stock is exhaustedDemilitarization required — critical (Q)
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FREQUENTLY ASKED QUESTIONS
What is 64-0009-001?
64-0009-001 is a MICROCIRCUIT,MEMORY.
What is the NSN for 64-0009-001?
64-0009-001 is cataloged in the U.S. Government catalog under NSN 5962-01-135-5488. This indicates validated use in U.S. government and defense supply chains.
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