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63BB114 — TRANSISTOR

✓ Government record, cited
— · SFP TRANSCEIVER
PRODUCT OVERVIEW

63BB114: TRANSISTOR.

The TRANSISTOR is a the manufacturer industrial component. Key specifications include overall_height: 0.325 INCHES MINIMUM AND 0.460 INCHES MAXIMUM IN, mounting_method: TERMINAL, special_features: JUNCTION PATTERN ARRANGEMENT: PNP, features_provided: HERMETICALLY SEALED CASE, internal_configuration: JUNCTION CONTACT, semiconductor_material: SILICON. This part is cataloged in the U.S.

Government catalog under NSN 5961-01-024-4462, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
63BB114
NSN: 5961-01-024-4462
FSC: 5961 — Semiconductor Devices and Associated Hardware
CAGE: 21845 — SOLITRON DEVICES, INC. (USA)
SPECIFICATIONS
overall_height0.325 INCHES MINIMUM AND 0.460 INCHES MAXIMUM IN
mounting_methodTERMINAL
special_featuresJUNCTION PATTERN ARRANGEMENT: PNP
features_providedHERMETICALLY SEALED CASE
internal_configurationJUNCTION CONTACT
semiconductor_materialSILICON
overall_width_across_flats0.667 INCHES MINIMUM AND 0.687 INCHES MAXIMUM IN
terminal_type_and_quantity3 UNINSULATED WIRE LEAD
NSN5961-01-024-4462
COMPONENT DIAGRAM
BAIL LATCH 10G SFP+ 850nm · SR (MMF, 300m) DOM: Digital Optical Monitoring TX RX LC DUPLEX 20-PIN EDGE CONNECTOR ~56.5 mm ~13.4mm SFP+ TRANSCEIVER | 10G | 850nm | SR (MMF, 300m) Hot-swappable | LC duplex fiber | DDM/DOM supported TITLE SFP+ XCVR PN 63BB114 MFR OEM TRANSISTOR
KEY FEATURES
•
MOUNTING METHOD: TERMINAL
•
SEMICONDUCTOR MATERIAL: SILICON
•
INTERNAL CONFIGURATION: JUNCTION CONTACT
•
FEATURES PROVIDED: HERMETICALLY SEALED CASE
•
OVERALL WIDTH ACROSS FLATS: 0.667 INCHES MINIMUM AND 0.687 INCHES MAXIMUM IN
•
TERMINAL TYPE AND QUANTITY: 3 UNINSULATED WIRE LEAD
TECHNICAL CHARACTERISTICS
OVERALL HEIGHT0.325 INCHES MINIMUM AND 0.460 INCHES MAXIMUM IN
MOUNTING METHODTERMINAL
SEMICONDUCTOR MATERIALSILICON
INTERNAL CONFIGURATIONJUNCTION CONTACT
FEATURES PROVIDEDHERMETICALLY SEALED CASE
OVERALL WIDTH ACROSS FLATS0.667 INCHES MINIMUM AND 0.687 INCHES MAXIMUM IN
SPECIAL FEATURESJUNCTION PATTERN ARRANGEMENT: PNP
TERMINAL TYPE AND QUANTITY3 UNINSULATED WIRE LEAD
OTHER ITEMS IN FSC 5961 — Semiconductor Devices and Associated Hardware
Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.
5961-00-000-0150 5961-00-000-4541 5961-00-000-5400 5961-00-000-7614 5961-00-000-8760 5961-00-001-1352 5961-00-001-2624 5961-00-001-2978
SUBSTITUTES & CROSS-REFERENCES 1
6388114Reference document
Same NSN cross-reference
Reference document — Secondary reference
LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Normally procured from the manufacturer (OEM)No demilitarization required
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FREQUENTLY ASKED QUESTIONS
What is 63BB114?
63BB114 is a TRANSISTOR.
What parts can replace 63BB114?
There is 1 known substitute for 63BB114: 6388114. Substitute compatibility should be verified for your specific system.
What is the NSN for 63BB114?
63BB114 is cataloged in the U.S. Government catalog under NSN 5961-01-024-4462. This indicates validated use in U.S. government and defense supply chains.
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