63A133591P4 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

63A133591P4: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.265 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN, body_height: 0.140 INCHES MINIMUM AND 0.165 INCHES MAXIMUM IN, body_length: 0.880 INCHES MINIMUM AND 0.920 INCHES MAXIMUM IN, memory_capacity: UNKNOWN, features_provided: HERMETICALLY SEALED AND HIGH PERFORMANCE AND 3-STATE OUTPUT AND HIGH SPEED, output_logic_form: METAL OXIDE-SEMICONDUCTOR LOGIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-159-3854, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

63A133591P4

NSN: 5962-01-159-3854
FSC: 5962 — Microcircuits, Electronic
CAGE: 16331 — LOCKHEED MARTIN CORPORATION DIV ROTARY AND MISSION SYSTEMS (USA)

SPECIFICATIONS

body_width	0.265 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
body_height	0.140 INCHES MINIMUM AND 0.165 INCHES MAXIMUM IN
body_length	0.880 INCHES MINIMUM AND 0.920 INCHES MAXIMUM IN
memory_capacity	UNKNOWN
features_provided	HERMETICALLY SEALED AND HIGH PERFORMANCE AND 3-STATE OUTPUT AND HIGH SPEED
output_logic_form	METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	RAM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	+0.0 TO 70.0 CELSIUS DEGC
input_circuit_pattern	15 INPUT
inclosure_configuration	DUAL-IN-LINE
NSN	5962-01-159-3854

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 15 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.265 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.140 INCHES MINIMUM AND 0.165 INCHES MAXIMUM IN

•

FEATURES PROVIDED: HERMETICALLY SEALED AND HIGH PERFORMANCE AND 3-STATE OUTPUT AND HIGH SPEED

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: RAM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	15 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.265 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
BODY HEIGHT	0.140 INCHES MINIMUM AND 0.165 INCHES MAXIMUM IN
FEATURES PROVIDED	HERMETICALLY SEALED AND HIGH PERFORMANCE AND 3-STATE OUTPUT AND HIGH SPEED
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	RAM
BODY LENGTH	0.880 INCHES MINIMUM AND 0.920 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic

Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.

5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909

SUBSTITUTES & CROSS-REFERENCES 2

MD2147H-2Reference document

Same NSN cross-reference

Reference document — Secondary reference

D2147H-2Reference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is 63A133591P4?

63A133591P4 is a MICROCIRCUIT,MEMORY.

What parts can replace 63A133591P4?

There are 2 known substitutes for 63A133591P4: MD2147H-2, D2147H-2. Substitute compatibility should be verified for your specific system.

What is the NSN for 63A133591P4?

63A133591P4 is cataloged in the U.S. Government catalog under NSN 5962-01-159-3854. This indicates validated use in U.S. government and defense supply chains.

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