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63A133591P1 — MICROCIRCUIT,MEMORY

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

63A133591P1: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.270 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN, body_height: 0.080 INCHES MINIMUM AND 0.130 INCHES MAXIMUM IN, body_length: 0.880 INCHES MINIMUM AND 0.920 INCHES MAXIMUM IN, bit_quantity: 4096, word_quantity: 4096, features_provided: HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND W/ENABLE AND 3-STATE OUTPUT. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-101-7964, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
63A133591P1
NSN: 5962-01-101-7964
FSC: 5962 — Microcircuits, Electronic
CAGE: 16331 — LOCKHEED MARTIN CORPORATION DIV ROTARY AND MISSION SYSTEMS (USA)
SPECIFICATIONS
body_width0.270 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
body_height0.080 INCHES MINIMUM AND 0.130 INCHES MAXIMUM IN
body_length0.880 INCHES MINIMUM AND 0.920 INCHES MAXIMUM IN
bit_quantity4096
word_quantity4096
features_providedHERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND W/ENABLE AND 3-STATE OUTPUT
output_logic_formN-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
precious_materialGOLD
inclosure_materialCERAMIC AND GLASS
memory_device_typeRAM
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range+0.0 TO 70.0 CELSIUS DEGC
NSN5962-01-101-7964
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 63A133591P1 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
BIT QUANTITY: 4096
•
INPUT CIRCUIT PATTERN: 15 INPUT
•
WORD QUANTITY: 4096
•
INCLOSURE MATERIAL: CERAMIC AND GLASS
•
TERMINAL SURFACE TREATMENT: GOLD
•
PRECIOUS MATERIAL: GOLD
•
BODY WIDTH: 0.270 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
•
BODY HEIGHT: 0.080 INCHES MINIMUM AND 0.130 INCHES MAXIMUM IN
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
BIT QUANTITY4096
INPUT CIRCUIT PATTERN15 INPUT
WORD QUANTITY4096
INCLOSURE MATERIALCERAMIC AND GLASS
TERMINAL SURFACE TREATMENTGOLD
PRECIOUS MATERIALGOLD
BODY WIDTH0.270 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
BODY HEIGHT0.080 INCHES MINIMUM AND 0.130 INCHES MAXIMUM IN
FEATURES PROVIDEDHERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND W/ENABLE AND 3-STATE OUTPUT
INCLOSURE CONFIGURATIONDUAL-IN-LINE
OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic
Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.
5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909
SUBSTITUTES & CROSS-REFERENCES 1
C2147-3Reference document
Same NSN cross-reference
Reference document — Secondary reference
LIFECYCLE
NSN statusActive· U.S. Government catalog
Demilitarization required — critical (Q)
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FREQUENTLY ASKED QUESTIONS
What is 63A133591P1?
63A133591P1 is a MICROCIRCUIT,MEMORY.
What parts can replace 63A133591P1?
There is 1 known substitute for 63A133591P1: C2147-3. Substitute compatibility should be verified for your specific system.
What is the NSN for 63A133591P1?
63A133591P1 is cataloged in the U.S. Government catalog under NSN 5962-01-101-7964. This indicates validated use in U.S. government and defense supply chains.
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