63A133262P4 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

63A133262P4: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.310 INCHES MAXIMUM IN, body_height: 0.185 INCHES MAXIMUM IN, body_length: 0.840 INCHES MAXIMUM IN, features_provided: MONOLITHIC AND PROGRAMMED AND BIPOLAR, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-097-1237, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

63A133262P4

NSN: 5962-01-097-1237
FSC: 5962 — Microcircuits, Electronic
CAGE: 16331 — LOCKHEED MARTIN CORPORATION DIV ROTARY AND MISSION SYSTEMS (USA)

SPECIFICATIONS

body_width	0.310 INCHES MAXIMUM IN
body_height	0.185 INCHES MAXIMUM IN
body_length	0.840 INCHES MAXIMUM IN
features_provided	MONOLITHIC AND PROGRAMMED AND BIPOLAR
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	PROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	10 INPUT
end_item_identification	DEVICE 20H6,PROPULSION ENGINEERING CONTROL SYSTEM,OPERATIONAL TRAINER
inclosure_configuration	DUAL-IN-LINE
NSN	5962-01-097-1237

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 10 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.310 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.185 INCHES MAXIMUM IN

•

FEATURES PROVIDED: MONOLITHIC AND PROGRAMMED AND BIPOLAR

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: PROM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	10 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.310 INCHES MAXIMUM IN
BODY HEIGHT	0.185 INCHES MAXIMUM IN
FEATURES PROVIDED	MONOLITHIC AND PROGRAMMED AND BIPOLAR
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	PROM
CASE OUTLINE SOURCE AND DESIGNATOR	D-2 MIL-M-38510
BODY LENGTH	0.840 INCHES MAXIMUM IN

SUBSTITUTES & CROSS-REFERENCES 2

ROM/PROM FAMILY 021Reference document

Same NSN cross-reference

Reference document — Secondary reference

M38510/20301BEAReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation

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FREQUENTLY ASKED QUESTIONS

What is 63A133262P4?

63A133262P4 is a MICROCIRCUIT,MEMORY.

What parts can replace 63A133262P4?

There are 2 known substitutes for 63A133262P4: ROM/PROM FAMILY 021, M38510/20301BEA. Substitute compatibility should be verified for your specific system.

What is the NSN for 63A133262P4?

63A133262P4 is cataloged in the U.S. Government catalog under NSN 5962-01-097-1237. This indicates validated use in U.S. government and defense supply chains.

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