639834-02 — Technical Data Sheet

✓ Verified by PartsTable

— · COMPONENT

WHAT YOU NEED TO KNOW

Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel

Confirm exact part number — similar PNs may be different parts

PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include features_provided: BURN IN AND MONOLITHIC AND PROGRAMMED AND ULTRAVIOLET ERASABLE, inclosure_material: CERAMIC, memory_device_type: PROM, storage_temp_range: -65.0 TO 150.0 CELSIUS DEGC, test_data_document: 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.)., operating_temp_range: -55.0 TO 125.0 CELSIUS DEGC. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System under NSN 5962-01-373-0574, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

639834-02

NSN: 5962-01-373-0574
FSC: 5962
CAGE: 07690 — BAE SYSTEMS CONTROLS INC (USA)

SPECIFICATIONS

features_provided	BURN IN AND MONOLITHIC AND PROGRAMMED AND ULTRAVIOLET ERASABLE
inclosure_material	CERAMIC
memory_device_type	PROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
inclosure_configuration	LEADLESS FLAT PACK
terminal_surface_treatment	SOLDER
terminal_type_and_quantity	28 LEADLESS
case_outline_source_and_designator	C-11 MIL-M-38510
voltage_rating_and_type_per_characteristic	7.0 VOLTS MAXIMUM POWER SOURCE
NSN	5962-01-373-0574

COMPONENT DIAGRAM

KEY FEATURES

•

OPERATING TEMP RANGE: -55.0 TO 125.0 CELSIUS DEGC

•

TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).

•

CASE OUTLINE SOURCE AND DESIGNATOR: C-11 MIL-M-38510

•

TERMINAL SURFACE TREATMENT: SOLDER

•

VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 7.0 VOLTS MAXIMUM POWER SOURCE

•

TERMINAL TYPE AND QUANTITY: 28 LEADLESS

•

MEMORY DEVICE TYPE: PROM

•

INCLOSURE MATERIAL: CERAMIC

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

OPERATING TEMP RANGE	-55.0 TO 125.0 CELSIUS DEGC
TEST DATA DOCUMENT	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
CASE OUTLINE SOURCE AND DESIGNATOR	C-11 MIL-M-38510
TERMINAL SURFACE TREATMENT	SOLDER
VOLTAGE RATING AND TYPE PER CHARACTERISTIC	7.0 VOLTS MAXIMUM POWER SOURCE
TERMINAL TYPE AND QUANTITY	28 LEADLESS
MEMORY DEVICE TYPE	PROM
INCLOSURE MATERIAL	CERAMIC
INCLOSURE CONFIGURATION	LEADLESS FLAT PACK
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

VERIFIED SUBSTITUTES & CROSS-REFERENCES 9

ROM/PROMInterchangeableGOVERNMENT REGISTRY