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636784-03 — MICROCIRCUIT,MEMORY

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

636784-03: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN, body_height: 0.030 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN, body_length: 1.180 INCHES MINIMUM AND 1.230 INCHES MAXIMUM IN, features_provided: STATIC OPERATION AND HIGH SPEED AND LOW POWER AND BIDIRECTIONAL AND HIGH PERFORMANCE AND HIGH RELIABILITY, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-377-1418, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
636784-03
NSN: 5962-01-377-1418
FSC: 5962 — Microcircuits, Electronic
CAGE: 07690 — BAE SYSTEMS CONTROLS INC (USA)
SPECIFICATIONS
body_width0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
body_height0.030 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN
body_length1.180 INCHES MINIMUM AND 1.230 INCHES MAXIMUM IN
features_providedSTATIC OPERATION AND HIGH SPEED AND LOW POWER AND BIDIRECTIONAL AND HIGH PERFORMANCE AND HIGH RELIABILITY
output_logic_formCOMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_materialCERAMIC
memory_device_typeRAM
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
test_data_document96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern22 INPUT
inclosure_configurationDUAL-IN-LINE
NSN5962-01-377-1418
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 636784-03 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
INPUT CIRCUIT PATTERN: 22 INPUT
•
INCLOSURE MATERIAL: CERAMIC
•
TERMINAL SURFACE TREATMENT: SOLDER
•
BODY WIDTH: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
•
BODY HEIGHT: 0.030 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN
•
FEATURES PROVIDED: STATIC OPERATION AND HIGH SPEED AND LOW POWER AND BIDIRECTIONAL AND HIGH PERFORMANCE AND HIGH RELIABILITY
•
INCLOSURE CONFIGURATION: DUAL-IN-LINE
•
CURRENT RATING PER CHARACTERISTIC: 105.00 MILLIAMPERES MAXIMUM SUPPLY
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
INPUT CIRCUIT PATTERN22 INPUT
INCLOSURE MATERIALCERAMIC
TERMINAL SURFACE TREATMENTSOLDER
BODY WIDTH0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
BODY HEIGHT0.030 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN
FEATURES PROVIDEDSTATIC OPERATION AND HIGH SPEED AND LOW POWER AND BIDIRECTIONAL AND HIGH PERFORMANCE AND HIGH RELIABILITY
INCLOSURE CONFIGURATIONDUAL-IN-LINE
CURRENT RATING PER CHARACTERISTIC105.00 MILLIAMPERES MAXIMUM SUPPLY
MEMORY DEVICE TYPERAM
BODY LENGTH1.180 INCHES MINIMUM AND 1.230 INCHES MAXIMUM IN
OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic
Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.
5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909
SUBSTITUTES & CROSS-REFERENCES 2
NH636784-03Reference document
Same NSN cross-reference
Reference document — Secondary reference
IDT6116LA25TDBRTReference document
Same NSN cross-reference
Reference document — Secondary reference
LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure
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FREQUENTLY ASKED QUESTIONS
What is 636784-03?
636784-03 is a MICROCIRCUIT,MEMORY.
What parts can replace 636784-03?
There are 2 known substitutes for 636784-03: NH636784-03, IDT6116LA25TDBRT. Substitute compatibility should be verified for your specific system.
What is the NSN for 636784-03?
636784-03 is cataloged in the U.S. Government catalog under NSN 5962-01-377-1418. This indicates validated use in U.S. government and defense supply chains.
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