636764-03 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

636764-03: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.290 INCHES MINIMUM AND 0.320 INCHES MAXIMUM IN, body_height: 0.200 INCHES MAXIMUM IN, features_provided: MONOLITHIC AND W/DISABLE AND W/ENABLE, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC, memory_device_type: RAM. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-371-2706, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

636764-03

NSN: 5962-01-371-2706
FSC: 5962 — Microcircuits, Electronic
CAGE: 07690 — BAE SYSTEMS CONTROLS INC (USA)

SPECIFICATIONS

body_width	0.290 INCHES MINIMUM AND 0.320 INCHES MAXIMUM IN
body_height	0.200 INCHES MAXIMUM IN
features_provided	MONOLITHIC AND W/DISABLE AND W/ENABLE
output_logic_form	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	RAM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
inclosure_configuration	DUAL-IN-LINE
terminal_surface_treatment	SOLDER
time_rating_per_chacteristic	45.00 NANOSECONDS MAXIMUM ACCESS NS
NSN	5962-01-371-2706

COMPONENT DIAGRAM

KEY FEATURES

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.290 INCHES MINIMUM AND 0.320 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.200 INCHES MAXIMUM IN

•

CAPITANCE RATING PER CHARACTERISTIC: 5.00 INPUT PICOFARADS MAXIMUM AND 7.00 OUTPUT PICOFARADS MAXIMUM

•

FEATURES PROVIDED: MONOLITHIC AND W/DISABLE AND W/ENABLE

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

CURRENT RATING PER CHARACTERISTIC: 100.00 MILLIAMPERES MAXIMUM SUPPLY

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.290 INCHES MINIMUM AND 0.320 INCHES MAXIMUM IN
BODY HEIGHT	0.200 INCHES MAXIMUM IN
CAPITANCE RATING PER CHARACTERISTIC	5.00 INPUT PICOFARADS MAXIMUM AND 7.00 OUTPUT PICOFARADS MAXIMUM
FEATURES PROVIDED	MONOLITHIC AND W/DISABLE AND W/ENABLE
INCLOSURE CONFIGURATION	DUAL-IN-LINE
CURRENT RATING PER CHARACTERISTIC	100.00 MILLIAMPERES MAXIMUM SUPPLY
MEMORY DEVICE TYPE	RAM
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES 2

P4C164-45CMBReference document

Same NSN cross-reference

Reference document — Secondary reference

CY7C185A-45DMBReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation

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FREQUENTLY ASKED QUESTIONS

What is 636764-03?

636764-03 is a MICROCIRCUIT,MEMORY.

What parts can replace 636764-03?

There are 2 known substitutes for 636764-03: P4C164-45CMB, CY7C185A-45DMB. Substitute compatibility should be verified for your specific system.

What is the NSN for 636764-03?

636764-03 is cataloged in the U.S. Government catalog under NSN 5962-01-371-2706. This indicates validated use in U.S. government and defense supply chains.

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636764-03 — MICROCIRCUIT,MEMORY

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