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Technical Data Sheet
636725-03 ✓ Verified by PartsTable
· COMPONENT
WHAT YOU NEED TO KNOW
Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel
Confirm exact part number — similar PNs may be different parts
PRODUCT OVERVIEW

The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN, body_height: 0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN, body_length: 1.280 INCHES MAXIMUM IN, bit_quantity: 18, overall_height: 0.325 INCHES MINIMUM AND 0.400 INCHES MAXIMUM IN, memory_capacity: 2K. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-292-3525, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
636725-03
NSN: 5962-01-292-3525
FSC: 5962
CAGE: 07690 — BAE SYSTEMS CONTROLS INC (USA)
SPECIFICATIONS
body_width0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
body_height0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN
body_length1.280 INCHES MAXIMUM IN
bit_quantity18
overall_height0.325 INCHES MINIMUM AND 0.400 INCHES MAXIMUM IN
memory_capacity2K
special_featuresPROGRAMMED
features_providedMONOLITHIC
output_logic_formTRANSISTOR-TRANSISTOR LOGIC
inclosure_materialSILICON
memory_device_typeROM
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
NSN5962-01-292-3525
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,DIGITAL TITLE COMPONENT PN 636725-03 MFR MICROCIRCUIT,DIGITAL
KEY FEATURES
BODY HEIGHT: 0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 7.0 VOLTS MAXIMUM POWER SOURCE
MEMORY DEVICE TYPE: ROM
TERMINAL TYPE AND QUANTITY: 24 PRINTED CIRCUIT
TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
CASE OUTLINE SOURCE AND DESIGNATOR: D-9 MIL-M-38510
TERMINAL SURFACE TREATMENT: SOLDER
FEATURES PROVIDED: BIPOLAR AND ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND PROGRAMMABLE AND PROGRAMMED
TECHNICAL CHARACTERISTICS (FLIS)
BODY HEIGHT0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN
VOLTAGE RATING AND TYPE PER CHARACTERISTIC7.0 VOLTS MAXIMUM POWER SOURCE
MEMORY DEVICE TYPEROM
TERMINAL TYPE AND QUANTITY24 PRINTED CIRCUIT
TEST DATA DOCUMENT96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
CASE OUTLINE SOURCE AND DESIGNATORD-9 MIL-M-38510
TERMINAL SURFACE TREATMENTSOLDER
FEATURES PROVIDEDBIPOLAR AND ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND PROGRAMMABLE AND PROGRAMMED
BODY WIDTH0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
OPERATING TEMP RANGE-55.0 TO 125.0 CELSIUS DEGC
VERIFIED SUBSTITUTES & CROSS-REFERENCES 17
M38510/21004BLBInterchangeable
interchangeable cross-reference
interchangeable
M38510/21004BLAInterchangeable
interchangeable cross-reference
interchangeable
5962-3821004BLXInterchangeable
interchangeable cross-reference
interchangeable
636725-03Interchangeable
interchangeable cross-reference
interchangeable
AM27S291A/BLAInterchangeable
interchangeable cross-reference
interchangeable
ROM/PROMInterchangeable
interchangeable cross-reference
interchangeable
LIFECYCLE
StatusACTIVE
AvailabilityOEM and secondary market
RoHS CompliantEAR99ESD SensitiveNot HAZMAT
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FREQUENTLY ASKED QUESTIONS
What is 636725-03?
636725-03 is a MICROCIRCUIT,DIGITAL.
What parts can replace 636725-03?
There are 17 known substitutes for 636725-03: M38510/21004BLB, M38510/21004BLA, 5962-3821004BLX and 14 more. Substitute compatibility should be verified for your specific system.
What is the NSN for 636725-03?
636725-03 is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-292-3525. This indicates validated use in U.S. government and defense supply chains.
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