635A211H01 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

635A211H01: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.250 INCHES NOMINAL IN, body_height: 0.365 INCHES NOMINAL IN, body_length: 0.820 INCHES MAXIMUM IN, features_provided: PROGRAMMED AND W/ENABLE AND 3-STATE OUTPUT AND HERMETICALLY SEALED AND MONOLITHIC, inclosure_material: CERAMIC, memory_device_type: ROM. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-026-0490, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

635A211H01

NSN: 5962-01-026-0490
FSC: 5962 — Microcircuits, Electronic
CAGE: 48306 — NORTHROP GRUMMAN SUPPORT SERVICES CORP (USA)

SPECIFICATIONS

body_width	0.250 INCHES NOMINAL IN
body_height	0.365 INCHES NOMINAL IN
body_length	0.820 INCHES MAXIMUM IN
features_provided	PROGRAMMED AND W/ENABLE AND 3-STATE OUTPUT AND HERMETICALLY SEALED AND MONOLITHIC
inclosure_material	CERAMIC
memory_device_type	ROM
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	10 INPUT
inclosure_configuration	DUAL-IN-LINE
terminal_surface_treatment	SOLDER
NSN	5962-01-026-0490

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 10 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.250 INCHES NOMINAL IN

•

BODY HEIGHT: 0.365 INCHES NOMINAL IN

•

FEATURES PROVIDED: PROGRAMMED AND W/ENABLE AND 3-STATE OUTPUT AND HERMETICALLY SEALED AND MONOLITHIC

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: ROM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	10 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.250 INCHES NOMINAL IN
BODY HEIGHT	0.365 INCHES NOMINAL IN
FEATURES PROVIDED	PROGRAMMED AND W/ENABLE AND 3-STATE OUTPUT AND HERMETICALLY SEALED AND MONOLITHIC
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	ROM
BODY LENGTH	0.820 INCHES MAXIMUM IN
OPERATING TEMP RANGE	-55.0 TO 125.0 CELSIUS DEGC

OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic

Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.

5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909

SUBSTITUTES & CROSS-REFERENCES 1

ROM/PROMReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Demilitarization required — critical (Q)

Ready to buy 635A211H01?

Compare prices from verified sellers on eBay

Buy on eBay →

As an eBay Partner, PartsTable may earn a commission. Your price is not affected.

FREQUENTLY ASKED QUESTIONS

What is 635A211H01?

635A211H01 is a MICROCIRCUIT,MEMORY.

What parts can replace 635A211H01?

There is 1 known substitute for 635A211H01: ROM/PROM. Substitute compatibility should be verified for your specific system.

What is the NSN for 635A211H01?

635A211H01 is cataloged in the U.S. Government catalog under NSN 5962-01-026-0490. This indicates validated use in U.S. government and defense supply chains.

Community Feedback

635A211H01 — MICROCIRCUIT,MEMORY

Request a Quote — 635A211H01