625266: MICROCIRCUIT,MEMORY.
The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.230 INCHES NOMINAL IN, body_height: 0.310 INCHES NOMINAL IN, body_length: 1.485 INCHES NOMINAL IN, bit_quantity: 2304, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-437-4877, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.230 INCHES NOMINAL IN |
| body_height | 0.310 INCHES NOMINAL IN |
| body_length | 1.485 INCHES NOMINAL IN |
| bit_quantity | 2304 |
| output_logic_form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| inclosure_material | CERAMIC |
| memory_device_type | FIRST-IN FIRST-OUT |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| inclosure_configuration | DUAL-IN-LINE |
| terminal_surface_treatment | SOLDER |
| maximum_power_dissipation_rating | 1.0 WATTS |
| NSN | 5962-01-437-4877 |
| BIT QUANTITY | 2304 |
| INCLOSURE MATERIAL | CERAMIC |
| TERMINAL SURFACE TREATMENT | SOLDER |
| BODY WIDTH | 0.230 INCHES NOMINAL IN |
| BODY HEIGHT | 0.310 INCHES NOMINAL IN |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CURRENT RATING PER CHARACTERISTIC | 125.00 MILLIAMPERES MAXIMUM SUPPLY |
| MEMORY DEVICE TYPE | FIRST-IN FIRST-OUT |
| BODY LENGTH | 1.485 INCHES NOMINAL IN |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |