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617768-901 — MICROCIRCUIT,MEMORY

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

617768-901: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.545 INCHES MAXIMUM IN, body_height: 0.185 INCHES NOMINAL IN, body_length: 1.455 INCHES MAXIMUM IN, features_provided: ERASABLE AND PROGRAMMABLE AND MONOLITHIC, output_logic_form: METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-232-5908, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
617768-901
NSN: 5962-01-232-5908
FSC: 5962 — Microcircuits, Electronic
CAGE: 37695 — RAYTHEON COMPANY (USA)
SPECIFICATIONS
body_width0.545 INCHES MAXIMUM IN
body_height0.185 INCHES NOMINAL IN
body_length1.455 INCHES MAXIMUM IN
features_providedERASABLE AND PROGRAMMABLE AND MONOLITHIC
output_logic_formMETAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_materialCERAMIC
memory_device_typeROM
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern13 INPUT
inclosure_configurationDUAL-IN-LINE
terminal_surface_treatmentSOLDER
NSN5962-01-232-5908
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 617768-901 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
INPUT CIRCUIT PATTERN: 13 INPUT
•
INCLOSURE MATERIAL: CERAMIC
•
TERMINAL SURFACE TREATMENT: SOLDER
•
BODY WIDTH: 0.545 INCHES MAXIMUM IN
•
BODY HEIGHT: 0.185 INCHES NOMINAL IN
•
FEATURES PROVIDED: ERASABLE AND PROGRAMMABLE AND MONOLITHIC
•
INCLOSURE CONFIGURATION: DUAL-IN-LINE
•
MEMORY DEVICE TYPE: ROM
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
INPUT CIRCUIT PATTERN13 INPUT
INCLOSURE MATERIALCERAMIC
TERMINAL SURFACE TREATMENTSOLDER
BODY WIDTH0.545 INCHES MAXIMUM IN
BODY HEIGHT0.185 INCHES NOMINAL IN
FEATURES PROVIDEDERASABLE AND PROGRAMMABLE AND MONOLITHIC
INCLOSURE CONFIGURATIONDUAL-IN-LINE
MEMORY DEVICE TYPEROM
BODY LENGTH1.455 INCHES MAXIMUM IN
STORAGE TEMP RANGE-65.0 TO 150.0 CELSIUS DEGC
OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic
Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.
5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909
SUBSTITUTES & CROSS-REFERENCES 3
ROM/PROM FAMILY 039Reference document
Same NSN cross-reference
Reference document — Secondary reference
R645551V18Reference document
Same NSN cross-reference
Reference document — Secondary reference
MD2764-45Reference document
Same NSN cross-reference
Reference document — Secondary reference
LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)
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FREQUENTLY ASKED QUESTIONS
What is 617768-901?
617768-901 is a MICROCIRCUIT,MEMORY.
What parts can replace 617768-901?
There are 3 known substitutes for 617768-901: ROM/PROM FAMILY 039, R645551V18, MD2764-45. Substitute compatibility should be verified for your specific system.
What is the NSN for 617768-901?
617768-901 is cataloged in the U.S. Government catalog under NSN 5962-01-232-5908. This indicates validated use in U.S. government and defense supply chains.
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