616483-801 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

616483-801: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.600 INCHES MAXIMUM IN, body_height: 0.220 INCHES MAXIMUM IN, body_length: 1.290 INCHES MAXIMUM IN, bit_quantity: 16384, word_quantity: 2048, features_provided: ULTRAVIOLET ERASABLE AND PROGRAMMABLE AND W/ENABLE AND POSITIVE OUTPUTS. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-235-6364, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

616483-801

NSN: 5962-01-235-6364
NIINs: 012356364, 012356939, 012356940, 012356941, 012356974
FSC: 5962 — Microcircuits, Electronic
CAGE: 37695 — RAYTHEON COMPANY (USA)

SPECIFICATIONS

body_width	0.600 INCHES MAXIMUM IN
body_height	0.220 INCHES MAXIMUM IN
body_length	1.290 INCHES MAXIMUM IN
bit_quantity	16384
word_quantity	2048
features_provided	ULTRAVIOLET ERASABLE AND PROGRAMMABLE AND W/ENABLE AND POSITIVE OUTPUTS
output_logic_form	METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	ROM
storage_temp_range	-65.0 TO 125.0 CELSIUS DEGC
operating_temp_range	-40.0 TO 85.0 CELSIUS DEGC
input_circuit_pattern	13 INPUT
NSN	5962-01-235-6364

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 12 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.610 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.220 INCHES MAXIMUM IN

•

FEATURES PROVIDED: ELECTROSTATIC SENSITIVE AND MONOLITHIC AND ULTRAVIOLET ERASABLE

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: ROM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	12 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.610 INCHES MAXIMUM IN
BODY HEIGHT	0.220 INCHES MAXIMUM IN
FEATURES PROVIDED	ELECTROSTATIC SENSITIVE AND MONOLITHIC AND ULTRAVIOLET ERASABLE
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	ROM
BODY LENGTH	1.290 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-55.0 TO 125.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES 2

ROM/PROMReference document

Same NSN cross-reference

Reference document — Secondary reference

M2716Reference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is 616483-801?

616483-801 is a MICROCIRCUIT,MEMORY.

What parts can replace 616483-801?

There are 2 known substitutes for 616483-801: ROM/PROM, M2716. Substitute compatibility should be verified for your specific system.

What is the NSN for 616483-801?

616483-801 is cataloged in the U.S. Government catalog under NSN 5962-01-235-6364. This indicates validated use in U.S. government and defense supply chains.

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616483-801 — MICROCIRCUIT,MEMORY

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