615572-904 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

615572-904: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.490 INCHES MINIMUM AND 0.550 INCHES MAXIMUM IN, body_height: 0.150 INCHES MAXIMUM IN, body_length: 1.175 INCHES MINIMUM AND 1.300 INCHES MAXIMUM IN, memory_capacity: UNKNOWN, features_provided: HERMETICALLY SEALED AND PROGRAMMABLE AND BURN IN AND POSITIVE OUTPUTS, output_logic_form: METAL OXIDE-SEMICONDUCTOR LOGIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-044-9916, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

615572-904

NSN: 5962-01-044-9916
FSC: 5962 — Microcircuits, Electronic
CAGE: 37695 — RAYTHEON COMPANY (USA)

SPECIFICATIONS

body_width	0.490 INCHES MINIMUM AND 0.550 INCHES MAXIMUM IN
body_height	0.150 INCHES MAXIMUM IN
body_length	1.175 INCHES MINIMUM AND 1.300 INCHES MAXIMUM IN
memory_capacity	UNKNOWN
features_provided	HERMETICALLY SEALED AND PROGRAMMABLE AND BURN IN AND POSITIVE OUTPUTS
output_logic_form	METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	ROM
storage_temp_range	-65.0 TO 125.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	+0.0 TO 70.0 CELSIUS DEGC
input_circuit_pattern	10 INPUT
NSN	5962-01-044-9916

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 10 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.490 INCHES MINIMUM AND 0.550 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.150 INCHES MAXIMUM IN

•

FEATURES PROVIDED: HERMETICALLY SEALED AND PROGRAMMABLE AND BURN IN AND POSITIVE OUTPUTS

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: ROM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	10 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.490 INCHES MINIMUM AND 0.550 INCHES MAXIMUM IN
BODY HEIGHT	0.150 INCHES MAXIMUM IN
FEATURES PROVIDED	HERMETICALLY SEALED AND PROGRAMMABLE AND BURN IN AND POSITIVE OUTPUTS
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	ROM
BODY LENGTH	1.175 INCHES MINIMUM AND 1.300 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 125.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES 2

ROM/PROMReference document

Same NSN cross-reference

Reference document — Secondary reference

1702AReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is 615572-904?

615572-904 is a MICROCIRCUIT,MEMORY.

What parts can replace 615572-904?

There are 2 known substitutes for 615572-904: ROM/PROM, 1702A. Substitute compatibility should be verified for your specific system.

What is the NSN for 615572-904?

615572-904 is cataloged in the U.S. Government catalog under NSN 5962-01-044-9916. This indicates validated use in U.S. government and defense supply chains.

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615572-904 — MICROCIRCUIT,MEMORY

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