615227-903 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

615227-903: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.280 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN, body_height: 0.110 INCHES MINIMUM AND 0.180 INCHES MAXIMUM IN, body_length: 0.740 INCHES MINIMUM AND 0.810 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND MONOLITHIC AND PROGRAMMABLE, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-00-477-0321, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

615227-903

NSN: 5962-00-477-0321
FSC: 5962 — Microcircuits, Electronic
CAGE: 37695 — RAYTHEON COMPANY (USA)

SPECIFICATIONS

body_width	0.280 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
body_height	0.110 INCHES MINIMUM AND 0.180 INCHES MAXIMUM IN
body_length	0.740 INCHES MINIMUM AND 0.810 INCHES MAXIMUM IN
features_provided	HERMETICALLY SEALED AND MONOLITHIC AND PROGRAMMABLE
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	10 INPUT
inclosure_configuration	DUAL-IN-LINE
terminal_surface_treatment	SOLDER
NSN	5962-00-477-0321

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 10 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.280 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.110 INCHES MINIMUM AND 0.180 INCHES MAXIMUM IN

•

FEATURES PROVIDED: HERMETICALLY SEALED AND MONOLITHIC AND PROGRAMMABLE

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: ROM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	10 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.280 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
BODY HEIGHT	0.110 INCHES MINIMUM AND 0.180 INCHES MAXIMUM IN
FEATURES PROVIDED	HERMETICALLY SEALED AND MONOLITHIC AND PROGRAMMABLE
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	ROM
BODY LENGTH	0.740 INCHES MINIMUM AND 0.810 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES 2

ROM/PROM FAMILY 005Reference document

Same NSN cross-reference

Reference document — Secondary reference

MM5201AM0DReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure

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FREQUENTLY ASKED QUESTIONS

What is 615227-903?

615227-903 is a MICROCIRCUIT,MEMORY.

What parts can replace 615227-903?

There are 2 known substitutes for 615227-903: ROM/PROM FAMILY 005, MM5201AM0D. Substitute compatibility should be verified for your specific system.

What is the NSN for 615227-903?

615227-903 is cataloged in the U.S. Government catalog under NSN 5962-00-477-0321. This indicates validated use in U.S. government and defense supply chains.

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615227-903 — MICROCIRCUIT,MEMORY

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