PartsTable
Technical Data Sheet
Download PDF

6135517-13 — MICROCIRCUIT,MEMORY

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

6135517-13: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include features_provided: BURN IN AND PROGRAMMED, inclosure_material: CERAMIC, memory_device_type: PAL, inclosure_configuration: FLAT PACK, terminal_surface_treatment: SOLDER, terminal_type_and_quantity: 24 FLAT LEADS. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-370-2012, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
6135517-13
NSN: 5962-01-370-2012
FSC: 5962 — Microcircuits, Electronic
CAGE: 03640 — LOCKHEED MARTIN CORPORATION DIV ROTARY AND MISSION SYSTEMS (USA)
SPECIFICATIONS
features_providedBURN IN AND PROGRAMMED
inclosure_materialCERAMIC
memory_device_typePAL
inclosure_configurationFLAT PACK
terminal_surface_treatmentSOLDER
terminal_type_and_quantity24 FLAT LEADS
voltage_rating_and_type_per_characteristic7.0 VOLTS MAXIMUM POWER SOURCE
NSN5962-01-370-2012
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 6135517-13 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
INCLOSURE MATERIAL: CERAMIC
•
TERMINAL SURFACE TREATMENT: SOLDER
•
FEATURES PROVIDED: BURN IN AND PROGRAMMED
•
INCLOSURE CONFIGURATION: FLAT PACK
•
MEMORY DEVICE TYPE: PAL
•
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 7.0 VOLTS MAXIMUM POWER SOURCE
•
TERMINAL TYPE AND QUANTITY: 24 FLAT LEADS
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
INCLOSURE MATERIALCERAMIC
TERMINAL SURFACE TREATMENTSOLDER
FEATURES PROVIDEDBURN IN AND PROGRAMMED
INCLOSURE CONFIGURATIONFLAT PACK
MEMORY DEVICE TYPEPAL
VOLTAGE RATING AND TYPE PER CHARACTERISTIC7.0 VOLTS MAXIMUM POWER SOURCE
TERMINAL TYPE AND QUANTITY24 FLAT LEADS
OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic
Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.
5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909
SUBSTITUTES & CROSS-REFERENCES

No substitute or cross-reference records for this part.

LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure
Ready to buy 6135517-13?
Compare prices from verified sellers on eBay
Buy on eBay →
As an eBay Partner, PartsTable may earn a commission. Your price is not affected.
FREQUENTLY ASKED QUESTIONS
What is 6135517-13?
6135517-13 is a MICROCIRCUIT,MEMORY.
What is the NSN for 6135517-13?
6135517-13 is cataloged in the U.S. Government catalog under NSN 5962-01-370-2012. This indicates validated use in U.S. government and defense supply chains.
Community Feedback
Leave a Comment
Comments are reviewed before appearing. You will receive an email to verify before your comment appears.

Request a Quote — 6135517-13