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Technical Data Sheet
PartsTable / COMPONENT / 6135511-1
6135511-1 ✓ Verified by PartsTable
— · COMPONENT
WHAT YOU NEED TO KNOW
Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel
Confirm exact part number — similar PNs may be different parts
PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include inclosure_material: CERAMIC, memory_device_type: PROGRAMMED, inclosure_configuration: FLAT PACK, terminal_surface_treatment: SOLDER, terminal_type_and_quantity: 20 FLAT LEADS. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-370-2931, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
6135511-1
NSN: 5962-01-370-2931
FSC: 5962
CAGE: 03640 — LOCKHEED MARTIN CORPORATION DIV ROTARY AND MISSION SYSTEMS (USA)
SPECIFICATIONS
inclosure_materialCERAMIC
memory_device_typePROGRAMMED
inclosure_configurationFLAT PACK
terminal_surface_treatmentSOLDER
terminal_type_and_quantity20 FLAT LEADS
NSN5962-01-370-2931
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 6135511-1 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
TERMINAL SURFACE TREATMENT: SOLDER
•
TERMINAL TYPE AND QUANTITY: 20 FLAT LEADS
•
INCLOSURE MATERIAL: CERAMIC
•
MEMORY DEVICE TYPE: PROGRAMMED
•
INCLOSURE CONFIGURATION: FLAT PACK
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS (FLIS)
TERMINAL SURFACE TREATMENTSOLDER
TERMINAL TYPE AND QUANTITY20 FLAT LEADS
INCLOSURE MATERIALCERAMIC
MEMORY DEVICE TYPEPROGRAMMED
INCLOSURE CONFIGURATIONFLAT PACK
VERIFIED SUBSTITUTES & CROSS-REFERENCES 8
82S131Interchangeable
interchangeable cross-reference
interchangeable
7621Interchangeable
interchangeable cross-reference
interchangeable
2843717Interchangeable
interchangeable cross-reference
interchangeable
114A009-1Interchangeable
interchangeable cross-reference
interchangeable
113A109-08-1Interchangeable
interchangeable cross-reference
interchangeable
ROM/PROMInterchangeable
interchangeable cross-reference
interchangeable
LIFECYCLE
StatusACTIVE
AvailabilityOEM and secondary market
RoHS CompliantEAR99ESD SensitiveNot HAZMAT
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FREQUENTLY ASKED QUESTIONS
What is 6135511-1?
6135511-1 is a MICROCIRCUIT,MEMORY.
What parts can replace 6135511-1?
There are 8 known substitutes for 6135511-1: 82S131, 7621, 2843717 and 5 more. Substitute compatibility should be verified for your specific system.
What is the NSN for 6135511-1?
6135511-1 is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-370-2931. This indicates validated use in U.S. government and defense supply chains.
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✓ Validated with multiple authoritative sources, including Government, OEM, and Certified sources.
PartsTable Design LLC · partstable.com
Last verified: July 2026