6135292-1 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

6135292-1: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 1.270 INCHES MAXIMUM IN, body_height: 0.138 INCHES MAXIMUM IN, body_length: 1.870 INCHES MAXIMUM IN, output_logic_form: N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC, storage_temp_range: -65.0 TO 150.0 CELSIUS DEGC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-397-2759, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

6135292-1

NSN: 5962-01-397-2759
FSC: 5962 — Microcircuits, Electronic
CAGE: 03640 — LOCKHEED MARTIN CORPORATION DIV ROTARY AND MISSION SYSTEMS (USA)

SPECIFICATIONS

body_width	1.270 INCHES MAXIMUM IN
body_height	0.138 INCHES MAXIMUM IN
body_length	1.870 INCHES MAXIMUM IN
output_logic_form	N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
hybrid_technology_type	MONOLITHIC
inclosure_configuration	PIN GRID ARRAY
terminal_surface_treatment	SOLDER
terminal_type_and_quantity	144 PIN
time_rating_per_chacteristic	4.00 NANOSECONDS MAXIMUM RISE TRANSIENT NS
NSN	5962-01-397-2759

COMPONENT DIAGRAM

KEY FEATURES

•

HYBRID TECHNOLOGY TYPE: MONOLITHIC

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 1.270 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.138 INCHES MAXIMUM IN

•

CAPITANCE RATING PER CHARACTERISTIC: 50.00 OUTPUT PICOFARADS MAXIMUM

•

INCLOSURE CONFIGURATION: PIN GRID ARRAY

•

BODY LENGTH: 1.870 INCHES MAXIMUM IN

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

HYBRID TECHNOLOGY TYPE	MONOLITHIC
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	1.270 INCHES MAXIMUM IN
BODY HEIGHT	0.138 INCHES MAXIMUM IN
CAPITANCE RATING PER CHARACTERISTIC	50.00 OUTPUT PICOFARADS MAXIMUM
INCLOSURE CONFIGURATION	PIN GRID ARRAY
BODY LENGTH	1.870 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC
OUTPUT LOGIC FORM	N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC

OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic

Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.

5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909

SUBSTITUTES & CROSS-REFERENCES 1

6135292-11Reference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandNo demilitarization required

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FREQUENTLY ASKED QUESTIONS

What is 6135292-1?

6135292-1 is a MICROCIRCUIT,MEMORY.

What parts can replace 6135292-1?

There is 1 known substitute for 6135292-1: 6135292-11. Substitute compatibility should be verified for your specific system.

What is the NSN for 6135292-1?

6135292-1 is cataloged in the U.S. Government catalog under NSN 5962-01-397-2759. This indicates validated use in U.S. government and defense supply chains.

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6135292-1 — MICROCIRCUIT,MEMORY

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