6135089-1: MICROCIRCUIT,MEMORY.
The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.400 INCHES MAXIMUM IN, body_height: 0.145 INCHES MINIMUM AND 0.175 INCHES MAXIMUM IN, body_length: 1.060 INCHES MINIMUM AND 1.100 INCHES MAXIMUM IN, special_features: NUCLEAR HARDNESS CRITICAL ITEMS, features_provided: PROGRAMMED AND BURN IN AND W/ENABLE, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-172-1473, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.400 INCHES MAXIMUM IN |
| body_height | 0.145 INCHES MINIMUM AND 0.175 INCHES MAXIMUM IN |
| body_length | 1.060 INCHES MINIMUM AND 1.100 INCHES MAXIMUM IN |
| special_features | NUCLEAR HARDNESS CRITICAL ITEMS |
| features_provided | PROGRAMMED AND BURN IN AND W/ENABLE |
| output_logic_form | TRANSISTOR-TRANSISTOR LOGIC |
| inclosure_material | CERAMIC |
| memory_device_type | RAM |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | 9 INPUT |
| inclosure_configuration | DUAL-IN-LINE |
| NSN | 5962-01-172-1473 |
| INPUT CIRCUIT PATTERN | 9 INPUT |
| INCLOSURE MATERIAL | CERAMIC |
| TERMINAL SURFACE TREATMENT | SOLDER |
| BODY WIDTH | 0.400 INCHES MAXIMUM IN |
| BODY HEIGHT | 0.145 INCHES MINIMUM AND 0.175 INCHES MAXIMUM IN |
| FEATURES PROVIDED | PROGRAMMED AND BURN IN AND W/ENABLE |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| MEMORY DEVICE TYPE | RAM |
| BODY LENGTH | 1.060 INCHES MINIMUM AND 1.100 INCHES MAXIMUM IN |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |