Name: MICROCIRCUIT,MEMORY
Brand: Unknown
SKU: 6133960-13

6133960-13 ✓ Verified by PartsTable

— · COMPONENT

WHAT YOU NEED TO KNOW

Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel

Confirm exact part number — similar PNs may be different parts

PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN, body_height: 0.210 INCHES MAXIMUM IN, body_length: 1.290 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND BIPOLAR AND POSITIVE OUTPUTS, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-098-9638, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

6133960-13

NSN: 5962-01-098-9638
FSC: 5962
CAGE: 03640 — LOCKHEED MARTIN CORPORATION DIV ROTARY AND MISSION SYSTEMS (USA)

SPECIFICATIONS

body_width	0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN
body_height	0.210 INCHES MAXIMUM IN
body_length	1.290 INCHES MAXIMUM IN
features_provided	HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND BIPOLAR AND POSITIVE OUTPUTS
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	14 INPUT
inclosure_configuration	DUAL-IN-LINE
NSN	5962-01-098-9638

COMPONENT DIAGRAM

KEY FEATURES

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MEMORY DEVICE TYPE: ROM

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VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 7.0 VOLTS MAXIMUM POWER SOURCE

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TIME RATING PER CHACTERISTIC: 80.00 NANOSECONDS MAXIMUM ACCESS NS

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TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).

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CURRENT RATING PER CHARACTERISTIC: 175.00 MILLIAMPERES MAXIMUM SUPPLY

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TERMINAL SURFACE TREATMENT: SOLDER

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TERMINAL TYPE AND QUANTITY: 24 PRINTED CIRCUIT

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CASE OUTLINE SOURCE AND DESIGNATOR: D-3 MIL-M-38510

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS (FLIS)

MEMORY DEVICE TYPE	ROM
VOLTAGE RATING AND TYPE PER CHARACTERISTIC	7.0 VOLTS MAXIMUM POWER SOURCE
TIME RATING PER CHACTERISTIC	80.00 NANOSECONDS MAXIMUM ACCESS NS
TEST DATA DOCUMENT	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
CURRENT RATING PER CHARACTERISTIC	175.00 MILLIAMPERES MAXIMUM SUPPLY
TERMINAL SURFACE TREATMENT	SOLDER
TERMINAL TYPE AND QUANTITY	24 PRINTED CIRCUIT
CASE OUTLINE SOURCE AND DESIGNATOR	D-3 MIL-M-38510
BODY HEIGHT	0.210 INCHES MAXIMUM IN
OUTPUT LOGIC FORM	TRANSISTOR-TRANSISTOR LOGIC

VERIFIED SUBSTITUTES & CROSS-REFERENCES 14

058-002010Interchangeable