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Technical Data Sheet

613-03 — Technical Data Sheet

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WHAT YOU NEED TO KNOW
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PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include material: STEEL OVERALL, overall_length: 0.1140 INCHES MINIMUM AND 0.1160 INCHES MAXIMUM IN, style_designator: SOLID, PLAIN, NO OUTSIDE FLANGES, features_provided: BIPOLAR AND PROGRAMMED AND MONOLITHIC, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, memory_device_type: ROM. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5365-00-954-6429, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
613-03
NSN: 5365-00-954-6429
FSC: 5365
CAGE: 82423 — KLEINSCHMIDT INC (USA)
SPECIFICATIONS
materialSTEEL OVERALL
overall_length0.1140 INCHES MINIMUM AND 0.1160 INCHES MAXIMUM IN
style_designatorSOLID, PLAIN, NO OUTSIDE FLANGES
features_providedBIPOLAR AND PROGRAMMED AND MONOLITHIC
output_logic_formTRANSISTOR-TRANSISTOR LOGIC
memory_device_typeROM
test_data_document96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
body_inside_diameter0.1730 INCHES MINIMUM AND 0.1750 INCHES MAXIMUM IN
body_outside_diameter0.2160 INCHES MINIMUM AND 0.2180 INCHES MAXIMUM IN
NSN5365-00-954-6429
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 613-03 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
BODY INSIDE DIAMETER: 0.1730 INCHES MINIMUM AND 0.1750 INCHES MAXIMUM IN
BODY OUTSIDE DIAMETER: 0.2160 INCHES MINIMUM AND 0.2180 INCHES MAXIMUM IN
MATERIAL: STEEL OVERALL
STYLE DESIGNATOR: SOLID, PLAIN, NO OUTSIDE FLANGES
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS (FLIS)
OVERALL LENGTH0.1140 INCHES MINIMUM AND 0.1160 INCHES MAXIMUM IN
BODY INSIDE DIAMETER0.1730 INCHES MINIMUM AND 0.1750 INCHES MAXIMUM IN
BODY OUTSIDE DIAMETER0.2160 INCHES MINIMUM AND 0.2180 INCHES MAXIMUM IN
MATERIALSTEEL OVERALL
STYLE DESIGNATORSOLID, PLAIN, NO OUTSIDE FLANGES
VERIFIED SUBSTITUTES & CROSS-REFERENCES 3
SM-A-917150-6Interchangeable
interchangeable cross-reference
interchangeable
6130-3Interchangeable
interchangeable cross-reference
interchangeable
ROM/PROM FAMILY 013Interchangeable
interchangeable cross-reference
interchangeable
LIFECYCLE
StatusACTIVE
AvailabilityOEM and secondary market
RoHS CompliantEAR99Not HAZMAT
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FREQUENTLY ASKED QUESTIONS
What is 613-03?
613-03 is a MICROCIRCUIT,MEMORY.
What parts can replace 613-03?
There are 3 known substitutes for 613-03: SM-A-917150-6, 6130-3, ROM/PROM FAMILY 013. Substitute compatibility should be verified for your specific system.
What is the NSN for 613-03?
613-03 is cataloged in the Federal Logistics Information System (FLIS) under NSN 5365-00-954-6429. This indicates validated use in U.S. government and defense supply chains.
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