6127715 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

6127715: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN, body_height: 0.150 INCHES MINIMUM AND 0.210 INCHES MAXIMUM IN, body_length: 1.290 INCHES MAXIMUM IN, overall_height: 0.345 INCHES MINIMUM AND 0.425 INCHES MAXIMUM IN, features_provided: BIPOLAR AND 3-STATE OUTPUT AND PROGRAMMABLE AND MONOLITHIC AND W/ENABLE, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-310-8701, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

6127715

NSN: 5962-01-310-8701
FSC: 5962 — Microcircuits, Electronic
CAGE: 53711 — NAVAL SEA SYSTEMS COMMAND (USA)

SPECIFICATIONS

body_width	0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN
body_height	0.150 INCHES MINIMUM AND 0.210 INCHES MAXIMUM IN
body_length	1.290 INCHES MAXIMUM IN
overall_height	0.345 INCHES MINIMUM AND 0.425 INCHES MAXIMUM IN
features_provided	BIPOLAR AND 3-STATE OUTPUT AND PROGRAMMABLE AND MONOLITHIC AND W/ENABLE
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	13 INPUT
inclosure_configuration	DUAL-IN-LINE
NSN	5962-01-310-8701

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 13 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.150 INCHES MINIMUM AND 0.210 INCHES MAXIMUM IN

•

FEATURES PROVIDED: BIPOLAR AND 3-STATE OUTPUT AND PROGRAMMABLE AND MONOLITHIC AND W/ENABLE

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

OVERALL HEIGHT	0.345 INCHES MINIMUM AND 0.425 INCHES MAXIMUM IN
INPUT CIRCUIT PATTERN	13 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN
BODY HEIGHT	0.150 INCHES MINIMUM AND 0.210 INCHES MAXIMUM IN
FEATURES PROVIDED	BIPOLAR AND 3-STATE OUTPUT AND PROGRAMMABLE AND MONOLITHIC AND W/ENABLE
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	ROM
CASE OUTLINE SOURCE AND DESIGNATOR	D-3 MIL-M-38510

SUBSTITUTES & CROSS-REFERENCES 2

ROM/PROM FAMILY 026Reference document

Same NSN cross-reference

Reference document — Secondary reference

2898447Reference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is 6127715?

6127715 is a MICROCIRCUIT,MEMORY.

What parts can replace 6127715?

There are 2 known substitutes for 6127715: ROM/PROM FAMILY 026, 2898447. Substitute compatibility should be verified for your specific system.

What is the NSN for 6127715?

6127715 is cataloged in the U.S. Government catalog under NSN 5962-01-310-8701. This indicates validated use in U.S. government and defense supply chains.

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6127715 — MICROCIRCUIT,MEMORY

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